المؤلفون: Wang, Daozheng, Wang, Xingang^{Aff1, IDs10346024023318_cor2}, Chen, Xiaoqing, Huang, Qiangbing, Wang, Jiading, Lian, Baoqin, Wang, Fei

المصدر: Landslides: Journal of the International Consortium on Landslides. :1-19

المؤلفون: Mohanan, Vidya^{Aff1, Aff2}, Pavithra, P. A.^{Aff1, Aff2}, Kumar, Lekshmi R. G.^{Aff1, IDs13399024060034_cor3}, Tejpal, C. S., Anas, K. K., Joshy, C. G., Abhirami, N.^{Aff1, Aff2}, Ashraf, P. Muhamed

المصدر: Biomass Conversion and Biorefinery: Processing of Biogenic Material for Energy and Chemistry. :1-11

المؤلفون: Yang, Ding, Chen, Jiaqi, Shen, Ao, Wang, Junfeng, Liu, Hailong^{Aff1, IDs1336702400098x_cor5}

المصدر: Korea-Australia Rheology Journal. 36(3):155-167

المؤلفون: Feng, Wen-Jun, Wu, Yan-He, Liu, Xiao-Yang, Wang, Zheng-Ke^{Aff1, IDs1011802431460_cor4}

المصدر: Chinese Journal of Polymer Science. 42(8):1147-1155

المؤلفون: Jaddu, Samuel, Dwivedi, Madhuresh, Pradhan, Rama Chandra^{Aff1, IDs1169402402592w_cor3}

المصدر: Journal of Food Measurement and Characterization. 18(7):5622-5628

المؤلفون: Gautam, L., Vinu, R., Gardas, R.L., Sarathi, R., Fofana, I., Rao, U.M.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 30(4):1632-1640 Aug, 2023

المؤلفون: Kelly, Nathaniel S.^{Aff1, Aff2, IDs0039702401447x_cor1}, Gill, Harinderjit S.^{Aff1, Aff2, Aff3}, Cookson, Andrew N.^{Aff1, Aff2, Aff3}, Fraser, Katharine H.^{Aff1, Aff2, Aff3}

المصدر: Rheologica Acta. 63(6):471-482

المؤلفون: Chupin, Laurent, Cîndea, Nicolae, Lacour, Geoffrey^{Aff1, IDs10231024014579_cor3}

المصدر: Annali di Matematica Pura ed Applicata (1923 -). :1-22

المؤلفون: Ma Shaochen, Yuan Zhipeng, Zhang Caijun

المصدر: Teshugang, Vol 45, Iss 5, Pp 76-84 (2024)

مصطلحات موضوعية: mold flux； shear thinning； sessile drop method； surface tension； microstructure, Materials of engineering and construction. Mechanics of materials, TA401-492, Technology

وصف الملف: electronic resource

Relation: http://www.specialsteeljournal.com/fileup/1003-8620/PDF/2024-00082.pdf; https://doaj.org/toc/1003-8620

URL الوصول: https://doaj.org/article/13b43551c62d4c1d9cbbff200eb2914b

المؤلفون: Fu, Xueqiong, Lu, Jibao, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)