المؤلفون: Lee, F.M., Tseng, P. H., Lin, Y. Y., Lin, Y. H., Weng, W. L., Lin, N. C., Sung, P. J., Yang, C. C., Wu, W. F., Shen, C. H., Chen, P. H., Lee, Y. H., Lee, M. H., Wang, K. C., Lu, C. Y.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Ambrosi, E., Wu, C. H., Song, M. Y., Lee, H. Y., Li, K. S., Lin, C. C., Hsu, C. F., Kuo, C. C., Chang, W. N., Chen, Y. J., Lin, C. H., Shieh, J. M., Shen, C. H., Lee, T. Y., Hou, T. H., Bao, X. Y.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Shih, P. S., Shen, C. H., Chen, Y. A., Huang, C. H., Grafner, S. J., Huang, J. H., Kao, C. R.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1294-1299 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Lin, Y. C., Shen, C. H., Hung, C. Y., Shih, P. S., Huang, J. H., Kao, C. L., Lin, Y. S., Hung, Y. C., Kao, C. R.

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :147-148 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Lin, A.S., Parashar, P., Huang, W.-M., Huang, Y.-W., Jian, D.-R., Kao, M.-H., Chen, S.-W., Shen, C.-H., Shieh, J.-M., Chen, T.-Y., Lin, C.-C., Kuo, H.-C.

المصدر: 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC) Photovoltaic Specialist Conference (PVSC), 2017 IEEE 44th. :1627-1630 Jun, 2017

Relation: 2017 IEEE 44th Photovoltaic Specialists Conference (PVSC)

المؤلفون: Chang, Y.-L., Tsai, M.-D., Shen, C.-H., Huang, C.-W., Wang, Y.-C., Kung, C.-W.

المصدر: In Materials Today Sustainability September 2023 23

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Shen, C.-H.

المصدر: In IRBM October 2022 43(5):470-478

المؤلفون: Huang, W.-H., Yang, C.-C., Hsieh, T.-Y., Wang, H.-H., Shen, C.-H., Shieh, J.-M.

المصدر: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the. :392-394 Jun, 2015

Relation: 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Chou, C. M., Shen, C. H., Hsiao, H. C., Chen, S. C.

المصدر: 2010 IEEE 17Th International Conference on Industrial Engineering and Engineering Management Industrial Engineering and Engineering Management (IE&EM), 2010 IEEE 17Th International Conference on. :642-645 Oct, 2010

Relation: 2010 IEEE 17Th International Conference on Industrial Engineering and Engineering Management (IE&EM2010)