المؤلفون: Zhu, G. K., Chen, H. Y., Fan, L.^{Aff2, IDs11223024006375_cor3}, Han, L. L., Shen, Y. L., Cao, Q. Z., Lin, Y., Dong, L. H.

المصدر: Strength of Materials. 56(1):155-165

المؤلفون: Shen, Y. L., Zhou, P., Wang, L. H., Sun, Q. Q., Tao, Q. Q., Wang, P. F., Ding, S. J., Zhang, D. W.

المصدر: 2013 IEEE 10th International Conference on ASIC ASIC (ASICON), 2013 IEEE 10th International Conference on. :1-4 Oct, 2013

Relation: 2013 IEEE 10th International Conference on ASIC (ASICON 2013)

المؤلفون: Sung, P.-J., Chang, C.-Y., Chen, L.-Y., Kao, K.-H., Su, C.-J., Liao, T.-H., Fang, C.-C., Wang, C.-J., Hong, T.-C., Jao, C.-Y., Hsu, H.-S., Luo, S.-X., Wang, Y.-S., Huang, H.-F., Li, J.-H., Huang, Y.-C., Hsueh, F.-K., Wu, C.-T., Huang, Y.-M., Hou, F.-J., Luo, G.-L., Shen, Y.-L., Ma, W. C.-Y., Huang, K.-P., Lin, K.-L., Samukawa, S., Li, Y., Huang, G.-W, Lee, Y.-J., Li, J.-Y., Wu, W.-F., Shieh, J.-M., Chao, T.-S., Yeh, W.-K., Wang, Y.-H.

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :21.4.1-21.4.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Su, C.-J., Tang, Y.-T, Tsou, Y.-C., Sung, P.-J., Hou, F.-J., Wang, C.-J., Chung, S.-T., Hsieh, C.-Y., Yeh, Y.-S., Hsueh, F.-K., Kao, K.-H., Chuang, S.-S., Wu, C.-T., You, T.-Y., Jian, Y.-L., Chou, T.-H., Shen, Y.-L., Chen, B.-Y., Luo, G.-L., Hong, T.-C., Huang, K.-P., Chen, M.-C., Lee, Y.-J., Chao, T.-S., Tseng, T.-Y., Wu, W.-F., Huang, G.-W., Shieh, J.-M., Yeh, W.-K., Wang, Y.-H.

المصدر: 2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T152-T153 Jun, 2017

Relation: 2017 Symposium on VLSI Technology

المؤلفون: Neidigk, M. A., Shen, Y.-L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(9):1492-1500 Sep, 2012

المؤلفون: Shen, Y.-L.

المصدر: 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296) Reliability physics Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International. :283-290 1999

Relation: 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual

المؤلفون: Shen, Y.-L., Shin, C.-S.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 9(12):1673-1678 Dec, 2009

المؤلفون: Shen, Y.-L.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 8(3):600-607 Sep, 2008

المؤلفون: Shen, Y.-L., Xu, L.

المصدر: 2008 10th IEEE International Conference on High Performance Computing and Communications High Performance Computing and Communications, 2008. HPCC '08. 10th IEEE International Conference on. :943-949 Sep, 2008

Relation: 2008 10th IEEE International Conference on High Performance Computing and Communications (HPCC)

المؤلفون: Guo, B., Wang, W.-D., Shen, Y.-L., Zhang, H.

المصدر: Fourth International Conference on Image and Graphics (ICIG 2007) Image and Graphics, 2007. ICIG 2007. Fourth International Conference on. :195-199 Aug, 2007

Relation: Fourth International Conference on Image and Graphics