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1مؤتمر
المؤلفون: Sheng-Ho Huang, Chun-Hsing Lee, Jen-Hao Yeh, Yuan-Chin Chen, Yu-Ming Huang, Fu-Yi Cheng, Hung-Lien Hu, Mu-Tao Chu
المصدر: 2008 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on. :49-52 Oct, 2008
Relation: 2008 International Conference on Electronic Materials and Packaging (EMAP)
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2
المؤلفون: Fuang Yuan Huang, Sheng Ho Huang, Biing Hwa Yan
المصدر: The International Journal of Advanced Manufacturing Technology. 29:695-706
مصطلحات موضوعية: Materials science, Mechanical Engineering, Bending, Surface finish, Fatigue limit, Industrial and Manufacturing Engineering, Computer Science Applications, Flexural strength, Control and Systems Engineering, Ultimate tensile strength, Forensic engineering, Fracture (geology), Surface roughness, Composite material, Software, Tensile testing
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3
المؤلفون: Sheng Ho Huang, Fuang Yuan Huang, Biing Hwa Yan
المصدر: The International Journal of Advanced Manufacturing Technology. 26:68-77
مصطلحات موضوعية: Control and Systems Engineering, Mechanical Engineering, Industrial and Manufacturing Engineering, Software, Computer Science Applications
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4
المؤلفون: Mu-Tao Chu, Hsiang-Hung Chang, Yuan-Chin Chen, Chao-Kai Hsu, Yu-Ming Huang, Chun-Hsing Lee, Sheng-Ho Huang, Huan-Chun Fu, Jen-Hao Yeh, Hung-Lien Hu
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Lamination (geology), Materials science, Optics, business.industry, Transmitter, Process (computing), Optoelectronics, FLEX, Link (geometry), business, Mobile device, Waveguide (optics), Data transmission
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::12cca4922167ea1fa38b2b7a0b2f0c48
https://doi.org/10.1109/impact.2010.5699625 -
5
المؤلفون: P. Tien, Fu-Yi Cheng, Chien Chun Lu, Hsiang-Hung Chang, Shu-Ming Chang, Yi-Jen Chan, Li-Cheng Shen, Kun-Yi Shen, Mu-Tao Chu, Shin-Ge Lee, Chun-Hsing Lee, Sheng-Ho Huang, Huan-Chun Fu
المصدر: Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Materials science, business.industry, Optical interconnect, Latency (audio), Skew, Electrical engineering, Chip, Signal, Footprint (electronics), Printed circuit board, Electronic engineering, business, Data transmission
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7de4bc877f7f66e5a94fb4efed3d0411
https://doi.org/10.1109/polytr.2007.4339163 -
6مؤتمر
المؤلفون: Sheng-Ho Huang, Chun-Hsing Lee, Hung-Lien Hu, Mu-Tao Chu, Jen-Hao Yeh, Yuan-Chin Chen, Yu-Ming Huang, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu
المصدر: Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-4, 4p
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7مؤتمر
المؤلفون: Shin-Ge Lee, Chun-Hsing Lee, Chien Chun Lu, Fu-Yi Cheng, Kun-Yi Shen, Sheng-Ho Huang, Li-Cheng Shen, Shu-Ming Chang, Hsiang-Hung Chang, Huan-Chun Fu, Tien, P., Mu-Tao Chu, Yi-Jen Chan
المصدر: Polytronic 2007 - 6th International Conference on Polymers & Adhesives in Microelectronics & Photonics; 2007, p179-182, 4p
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