المؤلفون: Shih, M.-K.^{Aff1, IDs40799023006795_cor1}, Liu, Y.-H., Lin, G.-S., Hsu, E., Yang, J.

المصدر: Experimental Techniques: Developments, Applications and Tutorials in Experimental Mechanics and Dynamics. 48(4):599-609

المؤلفون: Tsai, M. Y., Yeh, J. H., Huang, P. S., Wang, Y. W., Chen, D. L., Shih, M. K., Tarng, David

المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :290-293 Oct, 2020

Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hu, I., Huang, H.-H., Huang, P.-C., Yu, J.-C., Liao, C.-N., Shih, M.-K., Tamg, D., Hung, C.P.

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :97-103 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Shih, H.-C., Tsai, F., Shih, M.-K., Tarng, D., Hung, C.P.

المصدر: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :187-190 Oct, 2019

Relation: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chen, H.-E., Yang, P., Hu, I., Shih, M.-K., Tarng, D., Hung, C.P.

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Wang, M.-H., Hu, I., Tsai, C., Shao, A., Shih, M.-K., Tarng, D., Hung, C.P.

المصدر: 2018 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2018 IEEE. :5-9 Nov, 2018

Relation: 2018 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Chen, H.-E., Shih, M.-K., Tarng, D., Hung, C.P.

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :93-96 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Shih, S., Lee, M.Y., Liao, T.-W., Liu, D.S., Shih, M.-K., Tarng, D., Hung, C.P.

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :58-61 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Shih, M.-K., Chen, R., Chen, P.B.S., Lee, Y.-C., Chen, K.Y.U., Hu, I., Chen, T.-Y., Tsai, L., Chen, E., Tsai, E., Tarng, D., Hung, C.P.

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1676-1682 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Shih, M.-K., Lai, Y.-S.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(2):435-439 Jun, 2009