المؤلفون: Shih, M. L., Shih, P. S., Huang, J. H., Chen, I. A., Wang, J. S., Ko, C. T., Lin, B. R., Yang, K. M., Lin, C. H., Lee, A. S., Kao, C. R.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Shih, M.-K.^{Aff1, IDs40799023006795_cor1}, Liu, Y.-H., Lin, G.-S., Hsu, E., Yang, J.

المصدر: Experimental Techniques: Developments, Applications and Tutorials in Experimental Mechanics and Dynamics. 48(4):599-609

المؤلفون: Shih, M., Wu, N., Lai, W., Chen, T., Kao, C., Hung, C.P.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):215-221 Jan, 2023

المؤلفون: Lin, Y., Shieh, M., Shih, M., Cheng, C.

المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 9(21):21946-21957 Nov, 2022

المؤلفون: Shih, M.-H., Sung, W.-P.^{Aff2, IDs40799022006122_cor2}

المصدر: Experimental Techniques: Developments, Applications and Tutorials in Experimental Mechanics and Dynamics. 47(6):1285-1299

المؤلفون: Shih, M., Huang, Y., Lin, G.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(2):296-305 Jun, 2022

المؤلفون: Shih, M., Lai, W., Liao, T., Chen, K., Chen, D., Hung, C.P.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(2):297-305 Feb, 2022

المؤلفون: Hu, H., Huang, Y., Tsai, Y., Shih, M., Chen, K.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 10:791-796 2022

المؤلفون: Mak, J., Kocanaogullari, D., Huang, X., Kersey, J., Shih, M., Grattan, E.S., Skidmore, E.R., Wittenberg, G.F., Ostadabbas, S., Akcakaya, M.

المصدر: IEEE Transactions on Neural Systems and Rehabilitation Engineering IEEE Trans. Neural Syst. Rehabil. Eng. Neural Systems and Rehabilitation Engineering, IEEE Transactions on. 30:1840-1850 2022

المؤلفون: Tsai, M. Y., Yeh, J. H., Huang, P. S., Wang, Y. W., Chen, D. L., Shih, M. K., Tarng, David

المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :290-293 Oct, 2020

Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)