المؤلفون: Shingo Taniyama, Ying-Hui Wang, Masahisa Fujino, Tadatomo Suga

المصدر: 2008 IEEE 9th VLSI Packaging Workshop of Japan VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th. :141-144 Dec, 2008

Relation: 2008 IEEE 9th VLSI Packaging Workshop of Japan

المؤلفون: Kazuya SANO, Kazuya ITOH, Tsuyoshi TANAKA, Naoaki SUEMASA, Takeharu KONAMI, Shingo TANIYAMA

المصدر: Japanese Journal of JSCE. 79

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f7b7fa84fc7ae24b8245726f29aa2b85
https://doi.org/10.2208/jscejj.22-00204

المؤلفون: Shingo Taniyama, Tadatomo Suga, Yinghui Wang, Masahisa Fujino

المصدر: 2008 IEEE 9th VLSI Packaging Workshop of Japan.

مصطلحات موضوعية: Crystallography, Surface activated bonding, Materials science, X-ray photoelectron spectroscopy, Etching (microfabrication), Wafer bonding, Anodic bonding, Surface roughness, Wafer, Thermocompression bonding, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a6d0539e12c0bf96caa069d1914c5dcc
https://doi.org/10.1109/vpwj.2008.4762236

المؤلفون: Paul B. Mockford, Vittorio Valentini, Hans Rudolf Ganz, Frederick F. Hunt, Ulf Nürnberger, P. Y. Manjure, André Demonté, Yasuharu Mikami, Tom W. Twardzik, Dieter Jungwirth, Tsutomu Zaiki, Pierre Boitel, Shingo Taniyama, Günter Hampejs, Niklaus Winkler

المصدر: fib Bulletins ISBN: 2883940517

مصطلحات موضوعية: Engineering, business.industry, Metallurgy, Factory (object-oriented programming), business, Corrosion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::442d1a85acf8d89e5a7b0be783796e94
https://doi.org/10.35789/fib.bull.0011

المؤلفون: Shingo Taniyama, Chenxi Wang, Tadatomo Suga, Yinghui Wang

المصدر: ECS Meeting Abstracts. :2217-2217

مصطلحات موضوعية: Materials science, Fabrication, Renewable Energy, Sustainability and the Environment, business.industry, Wafer bonding, Thermocompression bonding, Moiré pattern, Condensed Matter Physics, Wafer backgrinding, Square (algebra), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Optics, Ir microscope, External reference, Anodic bonding, Materials Chemistry, Electrochemistry, Wafer, Nanometre, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9f1a2802569c3ec8a651971214d8c87d
https://doi.org/10.1149/ma2008-02/33/2217

المؤلفون: Yasushi Umeda, Shinichi Fukushige, Shingo Taniyama

المصدر: Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21. :8F626

مصطلحات موضوعية: Mass reduction, business.industry, Product (mathematics), Structure (category theory), General Medicine, Process engineering, business, Design methods, Mathematics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::07aa6fcc236e83a375504e07a3bffb4e
https://doi.org/10.1299/jsmelem.2007.4.8f626