يعرض 1 - 10 نتائج من 24 نتيجة بحث عن '"Shinosky, Michael"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    Layout dependence of gate dielectric TDDB in HKMG FinFET technology

    المؤلفون: Liu, Wen, Wu, Ernest, Guarin, Fernando, Griffin, Charles, Dufresne, Roger, Badami, Dinesh, Shinosky, Michael, Brochu, David

    المصدر: 2016 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2016 IEEE International. :7A-3-1-7A-3-5 Apr, 2016

    Relation: 2016 IEEE International Reliability Physics Symposium (IRPS)

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  2. 2
    مؤتمر
    Diagnostic electromigration reliability evaluation with a local sensing structure

    المؤلفون: Chen, Fen, Mccullen, Erik, Christiansen, Cathryn, Shinosky, Michael, Dufresne, Roger, Periasamy, Prakash, Kontra, Rick, Graas, Carole, StOnge, Gary

    المصدر: 2015 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2015 IEEE International. :2D.4.1-2D.4.7 Apr, 2015

    Relation: 2015 IEEE International Reliability Physics Symposium (IRPS)

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  3. 3
    مؤتمر
    A method for rapid screening of various low-k TDDB models

    المؤلفون: Chen, Fen, Graas, Carole, Shinosky, Michael, Burke, Chad, Feng, Kai D, Bocash, Craig, Muralidhar, Ramachandran

    المصدر: 2015 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2015 IEEE International. :3A.1.1-3A.1.11 Apr, 2015

    Relation: 2015 IEEE International Reliability Physics Symposium (IRPS)

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  4. 4
    مؤتمر
    New breakdown data generation and analytics methodology to address BEOL and mol dielectric TDDB process development and technology qualification challenges

    المؤلفون: Chen, Fen, Graas, Carole, Shinosky, Michael, Griffin, Chuck, Dufresne, Roger, Bolam, Ronald, Christiansen, Cathryn, Kai Zhao, Narasimha, Shreesh, Tian, Chunyan, Choon-Leong Lou

    المصدر: 2014 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2014 IEEE International. :3A.1.1-3A.1.11 Jun, 2014

    Relation: 2014 IEEE International Reliability Physics Symposium (IRPS)

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  5. 5
    مؤتمر
    Temperature and field interrelation study of low-k TDDB for Cu interconnects with and without liner - New insights to the roles of Cu for a competing breakdown process

    المؤلفون: Chen, Fen, Shinosky, Michael, Aitken, John, Yang, Chih-Chao, Edelstein, Daniel

    المصدر: 2013 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2013 IEEE International. :2F.2.1-2F.2.7 Apr, 2013

    Relation: 2013 IEEE International Reliability Physics Symposium (IRPS)

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  6. 6
    مؤتمر
    New electrical testing structures and analysis method for MOL and BEOL process diagnostics and TDDB reliability assessment

    المؤلفون: Chen, Fen, Mittl, Steven, Shinosky, Michael, Dufresne, Roger, Aitken, John, Wang, Yanfeng, Kolvenback, Kevin, Henson, William K, Mocuta, Dan

    المصدر: 2013 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2013 IEEE International. :PI.1.1-PI.1.5 Apr, 2013

    Relation: 2013 IEEE International Reliability Physics Symposium (IRPS)

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  7. 7
    مؤتمر
    Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB

    المؤلفون: Chen, Fen, Gambino, Jeffrey, Shinosky, Michael, Aitken, John, Huang, Elbert, Cohen, Stephan, Yang, Chih-Chao, Edelstein, Dan, Wang, Yun, Kane, Terry, Kioussis, Dimitri

    المصدر: 2012 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2012 IEEE International. :3A.3.1-3A.3.9 Apr, 2012

    Relation: 2012 IEEE International Reliability Physics Symposium (IRPS)

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  8. 8
    مؤتمر
    Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues

    المؤلفون: Chen, Fen, Mittl, Steve, Shinosky, Michael, Swift, Ann, Kontra, Rick, Anderson, Brent, Aitken, John, Wang, Yanfeng, Kinser, Emily, Kumar, Mahender, Wang, Yun, Kane, Terence, Feng, Kai D., Henson, William K, Mocuta, Dan, Li, Di-an

    المصدر: 2012 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2012 IEEE International. :6A.4.1-6A.4.9 Apr, 2012

    Relation: 2012 IEEE International Reliability Physics Symposium (IRPS)

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  9. 9
    دورية أكاديمية
    Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges

    المؤلفون: Chen, F., Graas, Carole, Shinosky, Michael, Zhao, Kai, Narasimha, Shreesh, Liu, Xiao Hu, Tian, Chunyan

    المصدر: In Microelectronics Reliability December 2015 55(12) Part B:2727-2747

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  10. 10
    دورية أكاديمية
    Soft breakdown characteristics of ultralow-k time-dependent dielectric breakdown for advanced complementary metal-oxide semiconductor technologies.

    المؤلفون: Shinosky, Michael, Fen Chena

    المصدر: Journal of Applied Physics; Sep2010, Vol. 108 Issue 5, p054107-41077, 7p, 2 Black and White Photographs, 12 Graphs

    مصطلحات موضوعية: VERY large scale circuit integration, DIELECTRICS, HEAT conduction, COPPER, METALS

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