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المؤلفون: Koichi Hasegawa, Shiro Kusumoto, Toyohiro Aoki, Kenzo Ohkita, Takashi Hisada, Hiroyuki Mori, Seiichirou Takahashi, Yasumitsu Orii, Eiji Nakamura, Jun Mukawa, Chihiro Kobata
المصدر: Journal of Photopolymer Science and Technology. 29:395-402
مصطلحات موضوعية: 010302 applied physics, Materials science, Polymers and Plastics, Organic Chemistry, 02 engineering and technology, Photoresist, 021001 nanoscience & nanotechnology, 01 natural sciences, Soldering, 0103 physical sciences, Materials Chemistry, Thermal stability, Composite material, 0210 nano-technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::663cda58c5f79eabdd734b2cd8180e12
https://doi.org/10.2494/photopolymer.29.395 -
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المؤلفون: Hidefumi Ishikawa, Shiro Kusumoto, Kenji Okamoto, Tetsuya Nemoto, Ryoji Tatara
المصدر: Journal of Photopolymer Science and Technology. 28:233-238
مصطلحات موضوعية: chemistry.chemical_classification, Materials science, Polymers and Plastics, chemistry, business.industry, Organic Chemistry, Materials Chemistry, Optoelectronics, Insulator (electricity), Polymer, Dielectric, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6f143632ac8a1104ffbbbfaf73b8dd87
https://doi.org/10.2494/photopolymer.28.233 -
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المؤلفون: Jae-Woong Nah, Katsumi Inomata, Toyohiro Aoki, Kazushige Toriyama, Seiichirou Takahashi, Hiroyuki Mori, Yasumitsu Orii, Shiro Kusumoto, Jun Mukawa, Kouichi Hasegawa
المصدر: International Symposium on Microelectronics. 2014:000713-000717
مصطلحات موضوعية: Materials science, Soldering, Automotive Engineering, Fine pitch, Bumping, Ultra fine, Photoresist, Composite material, Solder alloy
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ccd242634b8f757fd25f45049e1e4d9f
https://doi.org/10.4071/isom-wp42 -
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المؤلفون: Toyohiro Aoki, Hiroyuki Mori, Kenzo Ohkita, Eiji Nakamura, Jun Mukawa, Yasumitsu Orii, Koichi Hasegawa, Takashi Hisada, Chihiro Kobata, Seiichirou Takahashi, Shiro Kusumoto
المصدر: 2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
مصطلحات موضوعية: Engineering drawing, Materials science, Fabrication, Resist, business.industry, Soldering, Electronic packaging, Bumping, Optoelectronics, Wafer, Photoresist, Electroplating, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5e9bf4a4d9b77d7854df154cc490ea4d
https://doi.org/10.1109/panpacific.2016.7428428 -
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المؤلفون: Yoshikazu Yamaguchi, Kenji Hoshiko, Shiro Kusumoto, Yusuke Anno, Masafumi Hori, Tsutomu Shimokawa, Goji Wakamatsu, Koichi Fujiwara, Michihiro Mita, Tomohiko Kakizawa, Takeo Shio
المصدر: Journal of Photopolymer Science and Technology. 22:641-646
مصطلحات موضوعية: Materials science, Polymers and Plastics, Resist, Etching (microfabrication), Organic Chemistry, Materials Chemistry, Process (computing), Multiple patterning, Process window, Nanotechnology, Throughput (business), Critical dimension, Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::954cb83eb6a7abe03543071670a3da25
https://doi.org/10.2494/photopolymer.22.641 -
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المؤلفون: Hirokazu Sakakibara, Shiro Kusumoto, Keiichi Sato, Hisanori Akimaru, Kouichi Hasegawa, Koichi Fujiwara, Kenji Okamoto, Akito Hiro
المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: Form factor (design), Materials science, Resist, business.industry, Soldering, Plating, Interposer, Electronic engineering, Optoelectronics, Wafer, Integrated circuit packaging, Photoresist, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::48fcd4d7f904d6e219301eaa7f187426
https://doi.org/10.1109/icept.2015.7236828 -
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المؤلفون: Tomohiro Matsuki, Kouichi Hasegawa, Shiro Kusumoto, Hirokazu Ito
المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
مصطلحات موضوعية: Microelectromechanical systems, Lift (force), Materials science, Fabrication, Interposer, Wafer, Undercut, Nanotechnology, Integrated circuit packaging, Photoresist
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c131bbec6e5605a370e2ac95f4a0ae56
https://doi.org/10.1109/icept.2015.7236829 -
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المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Stress (mechanics), Chemical resistance, Materials science, Through-silicon via, Anodic bonding, Residual stress, Thermal resistance, Thermal, Wafer, Composite material
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::93ae008ff4fe7769f0fcc52227a0b4ba
https://doi.org/10.1109/ectc.2015.7159700 -
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المؤلفون: Hirokazu Ito, Kouichi Hasegawa, Shiro Kusumoto, Tomohiro Matsuki
المصدر: 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
مصطلحات موضوعية: Microelectromechanical systems, Lift (force), Materials science, Fabrication, Undercut, Nanotechnology, Integrated circuit packaging, Photoresist, Cost savings
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f097af6b9680fbe3ac4a283d5671292
https://doi.org/10.1109/icep-iaac.2015.7111091 -
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المؤلفون: Hirokazu Sakakibara, Shiro Kusumoto, Keiichi Sato, Kenji Okamoto, Akito Hiro, Koichi Fujiwara, Hisanori Akimaru
المصدر: 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
مصطلحات موضوعية: Materials science, Resist, business.industry, Plating, Package on package, Personal computer, Optoelectronics, Bumping, Wafer, Nanotechnology, Photoresist, business, Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a235b7b23ec57b38459466973c2c29ec
https://doi.org/10.1109/icep-iaac.2015.7111090