يعرض 1 - 5 نتائج من 5 نتيجة بحث عن '"Shue, Winston S."', وقت الاستعلام: 0.80s تنقيح النتائج
  1. 1
    مؤتمر
    Airgap Integration on Patterned Metal Lines for Advanced Interconnect Performance Scaling

    المؤلفون: Chang, H.K., Huang, H.Y., Lo, T.Y, Lee, S.K., Yang, K.W., Tang, C.L., Liu, Gary, Wu, C.T., Lin, M.H., Chu, W.C., Kuo, T.J., Fu, S.K., Tien, H.W., Tsai, C.H., Wei, Megan, Chen, H.P., Lee, M.H., Lu, C.W., Shue, Winston S., Cao, Min

    المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-4 May, 2023

    Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

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  2. 2
    مؤتمر
    A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects

    المؤلفون: Lin, Y.H., Lee, C.C., Liao, C.Y., Lin, M.H., Tu, W. C., Chen, Robin, Chen, H.P., Shue, Winston S., Cao, Min

    المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-4 Mar, 2023

    Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

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  3. 3
    مؤتمر
    Fully Self-Aligned Via Integration for Interconnect Scaling Beyond 3nm Node

    المؤلفون: Chen, H.P., Wu, Y.H., Huang, H.Y., Tsai, C.H., Lee, S.K., Lee, C.C., Wei, T.H., Yao, H.C., Wang, Y.C., Liao, C.Y., Chang, H.K., Lu, C.W., Shue, Winston S., Cao, Min

    المصدر: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :22.1.1-22.1.4 Dec, 2021

    Relation: 2021 IEEE International Electron Devices Meeting (IEDM)

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  4. 4
    مؤتمر
    The Overview of Current Interconnect Technology Challenges and Future Opportunities

    المؤلفون: Lee, M.H., Shue, Winston S.

    المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :32.1.1-32.1.4 Dec, 2020

    Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

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  5. 5
    مؤتمر
    Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

    المؤلفون: Chen, D.Y., Chiou, W.C., Chen, M.F., Wang, T.D., Ching, K.M., Tu, H.J., Wu, W.J., Yu, C.L., Yang, K.F., Chang, H.B., Tseng, M.H., Hsiao, C.W., Lu, Y.J., Hu, H.P., Lin, Y.C., Hsu, C.S., Shue, Winston S., Yu, C.H.

    المصدر: 2009 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2009 IEEE International. :1-4 Dec, 2009

    Relation: 2009 IEEE International Electron Devices Meeting (IEDM)

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