يعرض 1 - 10 نتائج من 14 نتيجة بحث عن '"Shyam Pal"', وقت الاستعلام: 0.95s تنقيح النتائج
  1. 1
    مؤتمر
    Advancement in resist materials for sub-7 nm patterning and beyond

    المؤلفون: Li Li, Xuan Liu, Shyam Pal

    المصدر: 2017 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2017 China. :1-3 Mar, 2017

    Relation: 2017 China Semiconductor Technology International Conference (CSTIC)

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  2. 2
    مؤتمر
    Integration of a poisoning-free dual damascene CDO film stack for 90 nm & beyond low-k BEOL

    المؤلفون: Wu Ping Liu, Juan Boon Tan, Wei Lu, Shyam Pal, Yong Kong Siew, Hai Cong, Bei Chao Zhang, Xian Bin Wang, Fan Zhang, Liang Choo Hsia

    المصدر: IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech). VLSI Technology VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on. :70-71 2005

    Relation: 2005 IEEE VLSI-TSA. International Symposium on VLSI Technology (VLSI-TSA-TECH)

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  3. 3
    Extreme ultraviolet resist materials for sub-7 nm patterning

    المؤلفون: Emmanuel P. Giannelis, Shulan Wang, Christopher K. Ober, Shyam Pal, Li Li, Xuan Liu

    المصدر: Chemical Society reviews. 46(16)

    مصطلحات موضوعية: 010302 applied physics, Fabrication, Computer science, Extreme ultraviolet lithography, High resolution, Nanotechnology, 02 engineering and technology, General Chemistry, Integrated circuit, 021001 nanoscience & nanotechnology, 01 natural sciences, law.invention, Resist, law, Extreme ultraviolet, 0103 physical sciences, Node (circuits), 0210 nano-technology, Lithography

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f879c09e9310618aa8da4b78da25bc1a
    https://pubmed.ncbi.nlm.nih.gov/28650497

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  4. 4
    High throughput and dense sampling metrology for process control

    المؤلفون: Hiroto Nozawa, Frank W. Mont, Yuji Asakawa, Jongwook Kye, Taher Kagalwala, Kuniaki Takeda, Francis Goodwin, Tsunehito Kohyama, Xintuo Dai, Wenhui Wang, Lei Sun, Granger Lobb, Shyam Pal

    المصدر: SPIE Proceedings.

    مصطلحات موضوعية: Materials science, business.industry, Sampling (statistics), Nanotechnology, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Metrology, 010309 optics, Optics, 0103 physical sciences, Process control, Wafer, 0210 nano-technology, Focus variation, business, Lithography, Critical dimension, Throughput (business)

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dcd2bac60d0678bd4aca361b4413ab59
    https://doi.org/10.1117/12.2258623

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  5. 5
    Line end shortening and iso-dense etch bias improvement by ALD spacer shrink process

    المؤلفون: Rui Chen, Bradley Morgenfeld, Aleksandra Clancy, Granger Lobb, Shyam Pal

    المصدر: SPIE Proceedings.

    مصطلحات موضوعية: Materials science, business.industry, Process (computing), Nanotechnology, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Line (electrical engineering), 010309 optics, Back end of line, Atomic layer deposition, 0103 physical sciences, Multiple patterning, Optoelectronics, 0210 nano-technology, business, Scaling, Critical dimension, Layer (electronics)

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::35474b5b771a3d590c4e4f707beb1d77
    https://doi.org/10.1117/12.2260450

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  6. 6
    Advancement in resist materials for sub-7 nm patterning and beyond

    المؤلفون: Xuan Liu, Shyam Pal, Li Li

    المصدر: 2017 China Semiconductor Technology International Conference (CSTIC).

    مصطلحات موضوعية: 010302 applied physics, Fabrication, Materials science, Extreme ultraviolet lithography, Nanotechnology, 02 engineering and technology, Integrated circuit, Photoresist, 021001 nanoscience & nanotechnology, 01 natural sciences, High volume manufacturing, law.invention, Resist, law, 0103 physical sciences, Multiple patterning, Node (circuits), 0210 nano-technology

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ea02d24745571de1f1a2af471d2c6496
    https://doi.org/10.1109/cstic.2017.7919757

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  7. 7
    10nm local interconnect challenge with iso-dense loading and improvement with ALD spacer process

    المؤلفون: Aleksandra Clancy, Ayman Hamouda, Ashwini Chandrasekhar, Shyam Pal, Jeff Shu, Christopher Ordonio, Jason Eugene Stephens, Chun Hui Low, Ming He, Prakash Periasamy, Mary Claire Silvestre, Anbu Selvam Km Mahalingam, Peter Welti, Craig Child, Granger Lobb, Ketan Shah

    المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

    مصطلحات موضوعية: Standard cell, Interconnection, Atomic layer deposition, Materials science, Technology scaling, Process (computing), Nanotechnology, Dry etching, Engineering physics, Scaling

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f7a2ece826e66bfdf116c6484b2c2ed5
    https://doi.org/10.1109/iitc-amc.2016.7507642

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  8. 8
    Metal wiring critical dimension shrink using ALD spacer in BEOL sub-50nm pitch

    المؤلفون: Craig Child, Prakash Periasamy, Ashwini Chandrasekhar, Shyam Pal, Chun Hui Low, Anbu Selvam Km Mahalingam, Ketan Shah, Christopher Ordonio, Peter Welti

    المصدر: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

    مصطلحات موضوعية: Materials science, Yield (engineering), business.industry, Nanotechnology, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, 010309 optics, Atomic layer deposition, Resist, Chemical-mechanical planarization, 0103 physical sciences, Optoelectronics, 0210 nano-technology, business, Lithography, Critical dimension, Layer (electronics), Shrinkage

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b2de681e559d4c68e72791f7ec32be1a
    https://doi.org/10.1109/asmc.2016.7491157

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  9. 9
    Evaluation of lens heating effect in high transmission NTD processes at the 20nm technology node

    المؤلفون: Yayi Wei, Sheldon Meyers, Sam Lee, Bumhwan Jeon, Chen Li, Sohan Singh Mehta, Lokesh Subramany, Shyam Pal, David Cho

    المصدر: Metrology, Inspection, and Process Control for Microlithography XXVIII.

    مصطلحات موضوعية: Zernike polynomials, Computer science, business.industry, Process (computing), Compensation (engineering), law.invention, Lens (optics), symbols.namesake, Optics, law, Limit (music), symbols, Reticle, Wafer, Node (circuits), business

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f56228637e4a5d8b246117f38e3b13c3
    https://doi.org/10.1117/12.2034206

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  10. 10
    High order wafer alignment for 20nm node logic process

    المؤلفون: Yun Tao Jiang, Mark Yelverton, Shyam Pal, Subramany Lokesh, Yayi Wei, Bumhwan Jeon, Sohan Singh Mehta, Chen Li

    المصدر: SPIE Proceedings.

    مصطلحات موضوعية: Development environment, Laser scanning, Computer science, Transistor, Polynomial order, Hardware_PERFORMANCEANDRELIABILITY, Grid, law.invention, law, Thermal, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer, High order

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1d8b1f9edb76829fbf0c305183e5d4e6
    https://doi.org/10.1117/12.2010709

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