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1دورية أكاديمية
المؤلفون: Kozuma, M., Komura, Y., Miyata, S., Okamoto, Y., Tamatsukuri, Y., Inoue, H., Saito, T., Kobayashi, H., Onuki, T., Yanagisawa, Y., Takeuchi, T., Okazaki, Y., Kunitake, H., Nakamura, D., Nagata, T., Yamane, Y., Ikeda, M., Yamazaki, S.
المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 12:187-194 2024
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2
المؤلفون: Svensson, Johannes, Olausson, Patrik, Menon, Heera, Lehmann, Sebastian, Lind, Erik, Borg, Mattias
المصدر: Nano Letters NanoLund: Centre for Nanoscience. 23(11):4756-4761
مصطلحات موضوعية: III-V semiconductors, InAs, metal-organic vapor-phase epitaxy, nanowires, selective area epitaxy, Si CMOS integration, Naturvetenskap, Fysik, Den kondenserade materiens fysik, Natural Sciences, Physical Sciences, Condensed Matter Physics
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3دورية أكاديمية
المؤلفون: Munehiro Kozuma, Yusuke Komura, Shoki Miyata, Yuki Okamoto, Yuki Tamatsukuri, Hiroki Inoue, Toshihiko Saito, Hidetomo Kobayashi, Tatsuya Onuki, Yuichi Yanagisawa, Toshihiko Takeuchi, Yutaka Okazaki, Hitoshi Kunitake, Daiki Nakamura, Takaaki Nagata, Yasumasa Yamane, Makoto Ikeda, Shunpei Yamazaki
المصدر: IEEE Journal of the Electron Devices Society, Vol 12, Pp 187-194 (2024)
مصطلحات موضوعية: CAAC-OS, Si CMOS, driver, microdisplay, high frame rate, and foveated rendering, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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4مؤتمر
المصدر: 2020 23rd International Microwave and Radar Conference (MIKON) Microwave and Radar Conference (MIKON), 2020 23rd International. :305-308 Oct, 2020
Relation: 2020 23rd International Microwave and Radar Conference (MIKON)
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5دورية أكاديمية
المؤلفون: Yasunaga, Y.
المصدر: IEEE Transactions on Engineering Management IEEE Trans. Eng. Manage. Engineering Management, IEEE Transactions on. 68(4):1179-1194 Aug, 2021
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6مؤتمر
المؤلفون: Wu, LiShu, Dai, JiaYun, Wei, Cheng, Kong, YueChan, Chen, TangShen, Zhang, Tong
المصدر: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2021 5th IEEE. :1-3 Apr, 2021
Relation: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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7مؤتمر
المؤلفون: Wang, Ming, Zhang, Youtao, Li, Xiaopeng, Zhang, Yi
المصدر: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Integrated Circuits and Microsystems (ICICM), 2019 IEEE 4th International Conference on. :53-56 Oct, 2019
Relation: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)
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8مؤتمر
المؤلفون: Lee, K.H., Zhang, L., Wang, Y., Lee, K.E.K., Chua, S.J., Fitzgerald, E.A., Tan, C.S.
المصدر: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2019 IEEE. :1-3 Oct, 2019
Relation: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
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9مؤتمر
المؤلفون: Dai, Jiayun, Han, Qunfei, Zhang, Youtao, Wang, Fei, Wu, Lishu, Kong, Yuechan
المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019
Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)
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10مؤتمر
المؤلفون: Yang, Yanhui, Zhang, Yi, Yang, Lei, Li, Xiaopeng, Zhang, Youtao, Liu, Zhonghua, Guo, Yufeng
المصدر: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) Electron Devices and Solid-State Circuits (EDSSC), 2019 IEEE International Conference on. :1-3 Jun, 2019
Relation: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)