المؤلفون: Kozuma, M., Komura, Y., Miyata, S., Okamoto, Y., Tamatsukuri, Y., Inoue, H., Saito, T., Kobayashi, H., Onuki, T., Yanagisawa, Y., Takeuchi, T., Okazaki, Y., Kunitake, H., Nakamura, D., Nagata, T., Yamane, Y., Ikeda, M., Yamazaki, S.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 12:187-194 2024

المؤلفون: Svensson, Johannes, Olausson, Patrik, Menon, Heera, Lehmann, Sebastian, Lind, Erik, Borg, Mattias

المصدر: Nano Letters NanoLund: Centre for Nanoscience. 23(11):4756-4761

مصطلحات موضوعية: III-V semiconductors, InAs, metal-organic vapor-phase epitaxy, nanowires, selective area epitaxy, Si CMOS integration, Naturvetenskap, Fysik, Den kondenserade materiens fysik, Natural Sciences, Physical Sciences, Condensed Matter Physics

URL الوصول: https://lup.lub.lu.se/record/2f2e61e4-0691-4ad8-8d03-8692bd35be05
http://dx.doi.org/10.1021/acs.nanolett.2c04908

المؤلفون: Munehiro Kozuma, Yusuke Komura, Shoki Miyata, Yuki Okamoto, Yuki Tamatsukuri, Hiroki Inoue, Toshihiko Saito, Hidetomo Kobayashi, Tatsuya Onuki, Yuichi Yanagisawa, Toshihiko Takeuchi, Yutaka Okazaki, Hitoshi Kunitake, Daiki Nakamura, Takaaki Nagata, Yasumasa Yamane, Makoto Ikeda, Shunpei Yamazaki

المصدر: IEEE Journal of the Electron Devices Society, Vol 12, Pp 187-194 (2024)

مصطلحات موضوعية: CAAC-OS, Si CMOS, driver, microdisplay, high frame rate, and foveated rendering, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10439975/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/7301f291d1704b3fb5931c96fe984c7b

المؤلفون: But, Dmytro B., Javadi, Elham, Knap, Wojciech, Ikamas, Kestutis, Lisauskas, Alvydas

المصدر: 2020 23rd International Microwave and Radar Conference (MIKON) Microwave and Radar Conference (MIKON), 2020 23rd International. :305-308 Oct, 2020

Relation: 2020 23rd International Microwave and Radar Conference (MIKON)

المؤلفون: Yasunaga, Y.

المصدر: IEEE Transactions on Engineering Management IEEE Trans. Eng. Manage. Engineering Management, IEEE Transactions on. 68(4):1179-1194 Aug, 2021

المؤلفون: Wu, LiShu, Dai, JiaYun, Wei, Cheng, Kong, YueChan, Chen, TangShen, Zhang, Tong

المصدر: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2021 5th IEEE. :1-3 Apr, 2021

Relation: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Wang, Ming, Zhang, Youtao, Li, Xiaopeng, Zhang, Yi

المصدر: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Integrated Circuits and Microsystems (ICICM), 2019 IEEE 4th International Conference on. :53-56 Oct, 2019

Relation: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)

المؤلفون: Lee, K.H., Zhang, L., Wang, Y., Lee, K.E.K., Chua, S.J., Fitzgerald, E.A., Tan, C.S.

المصدر: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2019 IEEE. :1-3 Oct, 2019

Relation: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Dai, Jiayun, Han, Qunfei, Zhang, Youtao, Wang, Fei, Wu, Lishu, Kong, Yuechan

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Yang, Yanhui, Zhang, Yi, Yang, Lei, Li, Xiaopeng, Zhang, Youtao, Liu, Zhonghua, Guo, Yufeng

المصدر: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) Electron Devices and Solid-State Circuits (EDSSC), 2019 IEEE International Conference on. :1-3 Jun, 2019

Relation: 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)