المؤلفون: Lee, S.K., Agrawal, A., Silberman, J., Ziegler, M., Kang, M., Venkataramani, S., Cao, N., Fleischer, B., Guillorn, M., Cohen, M., Mueller, S.M., Oh, J., Lutz, M., Jung, J., Koswatta, S., Zhou, C., Zalani, V., Kar, M., Bonanno, J., Casatuta, R., Chen, C., Choi, J., Haynie, H., Herbert, A., Jain, R., Kim, K., Li, Y., Ren, Z., Rider, S., Schaal, M., Schelm, K., Scheuermann, M.R., Sun, X., Tran, H., Wang, N., Wang, W., Zhang, X., Shah, V., Curran, B., Srinivasan, V., Lu, P., Shukla, S., Gopalakrishnan, K., Chang, L.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 57(1):182-197 Jan, 2022

المؤلفون: Venkataramani, S., Sun, X., Wang, N., Chen, C., Choi, J., Kang, M., Agarwal, A., Oh, J., Jain, S., Babinsky, T., Cao, N., Fox, T., Fleischer, B., Gristede, G., Guillorn, M., Haynie, H., Inoue, H., Ishizaki, K., Klaiber, M., Lo, S., Maier, G., Mueller, S., Scheuermann, M., Ogawa, E., Schaal, M., Serrano, M., Silberman, J., Vezyrtzis, C., Wang, W., Yee, F., Zhang, J., Ziegler, M., Zhou, C., Ohara, M., Lu, P., Curran, B., Shukla, S., Srinivasan, V., Chang, L., Gopalakrishnan, K.

المصدر: Proceedings of the IEEE Proc. IEEE Proceedings of the IEEE. 108(12):2232-2250 Dec, 2020

المؤلفون: Shukla, S., Fleischer, B., Ziegler, M., Silberman, J., Oh, J., Srinivasan, V., Choi, J., Mueller, S., Agrawal, A., Babinsky, T., Cao, N., Chen, C., Chuang, P., Fox, T., Gristede, G., Guillorn, M., Haynie, H., Klaiber, M., Lee, D., Lo, S., Maier, G., Scheuermann, M., Venkataramani, S., Vezyrtzis, C., Wang, N., Yee, F., Zhou, C., Lu, P., Curran, B., Chang, L., Gopalakrishnan, K.

المصدر: IEEE Solid-State Circuits Letters IEEE Solid-State Circuits Lett. Solid-State Circuits Letters, IEEE. 1(12):217-220 Dec, 2018

المؤلفون: Scheuermann, M., Tian, S., Robertazzi, R., Wordeman, M., Bergeron, C., Jacobson, H., Restle, P., Silberman, J., Tyberg, C.

المصدر: 2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016

Relation: 2016 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Gu, X., Silberman, J. A., Young, A. M., Jenkins, K. A., Dang, B., Liu, Y., Duan, X., Gordin, R., Shlafman, S., Goren, D.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(11):1917-1925 Nov, 2013

المؤلفون: Swaminathan, S., Patel, S.B., Dieffenderfer, J., Silberman, J.

المصدر: Sixth international symposium on quality electronic design (isqed'05) Quality Electronic Design Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on. :54-58 2005

Relation: Proceedings. 6th International Symposium on Quality Electronic Design

المؤلفون: Takahashi, O., Cook, R., Cottier, S., Dhong, S.H., Flachs, B., Hirairi, K., Kawasumi, A., Murakami, H., Noro, H., Oh, H., Onishi, S., Pille, J., Silberman, J., Yong, S.

المصدر: Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. VLSI Circuits VLSI Circuits, 2005. Digest of Technical Papers. 2005 Symposium on. :20-23 2005

Relation: 2005 Symposium on VLSI Circuits

المؤلفون: Takahashi, O., Cook, R., Cottier, S., Dhong, S.H., Flachs, B., Hirairi, K., Kawasumi, A., Murakami, H., Noro, H., Oh, H., Onish, S., Pille, J., Silberman, J.

المصدر: ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005. Computer Aided Design Computer-Aided Design, 2005. ICCAD-2005. IEEE/ACM International Conference on. :111-117 2005

Relation: ICCAD-2005 International Conference on Computer Aided Design

المؤلفون: Posluszny, S., Aoki, N., Boerstler, D., Coulman, P., Dhong, S., Flachs, B., Hofstee, P., Kojima, N., Kwon, O., Lee, K., Meltzer, D., Nowka, K., Park, J., Peter, J., Silberman, J., Takahashi, O., Villarrubial, P.

المصدر: Proceedings 37th Design Automation Conference Design Automation Conference, 2000. Proceedings 2000. :712-717 2000

Relation: Proceedings 37th Design Automation Conference

المؤلفون: Posluszny, S., Aoki, N., Boerstler, D., Burns, J., Dhong, S., Ghoshal, U., Hofstee, P., LaPotin, D., Lee, K., Meltzer, D., Ngo, H., Nowka, K., Silberman, J., Takahashi, O., Vo, I.

المصدر: Proceedings International Conference on Computer Design. VLSI in Computers and Processors (Cat. No.98CB36273) Computer design: VLSI in computers and processors Computer Design: VLSI in Computers and Processors, 1998. ICCD '98. Proceedings. International Conference on. :17-23 1998

Relation: Proceedings International Conference on Computer Design. VLSI in Computers and Processors