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المؤلفون: Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock
المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::edf2163a01793d0ae6284d27a0f30830
https://doi.org/10.1109/irps48203.2023.10117636 -
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المؤلفون: S. Schlipf, Ehrenfried Zschech, André Clausner, Jens Paul, Laura Wambera, Karsten Meier, Simone Capecchi
المساهمون: Publica
المصدر: IEEE Transactions on Device and Materials Reliability. 21:9-16
مصطلحات موضوعية: piezoresistive effect, geometry, ring oscillator (RO), Materials science, Integrated circuit, transistor degradation, 01 natural sciences, PMOS logic, Contact force, law.invention, Stress (mechanics), stress, strain, chip-packages interaction (CPI), law, Indentation, 0103 physical sciences, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, NMOS logic, degradation, 010302 applied physics, finite element method (FEM), Transistor, silicon, Electronic, Optical and Magnetic Materials, indentation, CMOS, logic gates, transistors
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3
المؤلفون: Jae Kyu Cho, Simone Capecchi, Frank Kuechenmeister, Christian Klewer, Jens Paul, Bjoern Boehme, Michael Thiele, Dirk Breuer
المصدر: International Symposium on Microelectronics. 2019:000169-000175
مصطلحات موضوعية: Wire bonding, Reliability (semiconductor), Computer science, Chip-scale package, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Chip, Flip chip, Envelope (motion)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::70c970aa9b05a777606b6ad3f2257528
https://doi.org/10.4071/2380-4505-2019.1.000169 -
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المؤلفون: Laura Wambera, Ehrenfried Zschech, Karsten Meier, André Clausner, Jens Paul, Simone Capecchi, S. Schlipf, C. Sander
المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Transistor, Silicon on insulator, Ring oscillator, Bending, 01 natural sciences, law.invention, Stress (mechanics), CMOS, law, 0103 physical sciences, Optoelectronics, business, Flip chip, Electronic circuit
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::832abb2ef286efc5e61285571362db46
https://doi.org/10.1109/eurosime52062.2021.9410858 -
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المؤلفون: S. Schlipf, Ehrenfried Zschech, Karsten Meier, Laura Wambera, Simone Capecchi, André Clausner, Jens Paul
المساهمون: Publica
مصطلحات موضوعية: Materials science, geometry, ring oscillator (RO), Silicon, Silicon on insulator, chemistry.chemical_element, 01 natural sciences, law.invention, Computer Science::Hardware Architecture, stress, strain, iron, law, Indentation, 0103 physical sciences, MOSFET, Electrical and Electronic Engineering, 010302 applied physics, business.industry, finite element method (FEM), Transistor, silicon, Strained silicon, Piezoresistive effect, piezoresistive coefficients, Computer Science::Other, Electronic, Optical and Magnetic Materials, indentation, chemistry, CMOS, logic gates, Optoelectronics, transistors, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0336c0a8546dcc445ba70b1f1c13644c
https://publica.fraunhofer.de/handle/publica/266391 -
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المؤلفون: Karsten Meier, Christian Goetze, Marcel Wieland, Simone Capecchi, Jens Paul, Karlheinz Bock, Laura Wambera, Bjoern Boehme
المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: business.industry, Computer science, Ball grid array, Soldering, Automotive industry, Temperature cycling, Electronics, business, Chip, Cycle count, Automotive electronics, Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::81e5c0337a9b385853394dfffc86cdde
https://doi.org/10.1109/estc48849.2020.9229734 -
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المؤلفون: André Clausner, Jens Paul, S. Schlipf, Laura Wambera, Karsten Meier, Simone Capecchi, Ehrenfried Zschech
المصدر: IRPS
مصطلحات موضوعية: Materials science, business.industry, Transistor, Ring oscillator, Bending, Integrated circuit, Nanoindentation, equipment and supplies, Piezoresistive effect, law.invention, Stress (mechanics), law, Optoelectronics, business, Electronic circuit
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9809ff939061861fc1945bb0318e4eef
https://doi.org/10.1109/irps45951.2020.9128221 -
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المؤلفون: André Clausner, Laura Wambera, Jens Paul, Karsten Meier, Simon Schlipf, Simone Capecchi, Ehrenfried Zschech
المساهمون: Publica
مصطلحات موضوعية: Materials science, business.industry, Process Chemistry and Technology, Transistor, Hardware_PERFORMANCEANDRELIABILITY, Ring oscillator, Chip, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Stress (mechanics), CMOS, law, Indentation, Hardware_INTEGRATEDCIRCUITS, Materials Chemistry, Microelectronics, Optoelectronics, Electrical and Electronic Engineering, business, Instrumentation, Electronic circuit
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::69542207f05aaff04bc4c5a3783818c5
https://publica.fraunhofer.de/handle/publica/269631 -
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المؤلفون: Simone Capecchi, André Clausner, Jens Paul, Ehrenfried Zschech, S. Schlipf, G. Kurz
المصدر: 2019 IEEE International Integrated Reliability Workshop (IIRW).
مصطلحات موضوعية: 010302 applied physics, Materials science, Mechanical load, business.industry, Cauchy stress tensor, Transistor, Ring oscillator, Integrated circuit, Nanoindentation, 01 natural sciences, Piezoresistive effect, law.invention, Stress (mechanics), law, 0103 physical sciences, Optoelectronics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ea1e368ec1c2dd9fd47bcc44b1b4df33
https://doi.org/10.1109/iirw47491.2019.8989902 -
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المؤلفون: Simone Capecchi, Frank Kuechenmeister, Bjoem Boehme, Christian Goetze, Ta-Chien Cheng, Dirk Breuer, Maricel Sy
المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
مصطلحات موضوعية: Substrate (building), Hysteresis, Yield (engineering), Materials science, Stack (abstract data type), Soldering, Design of experiments, Composite material, Chip, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::610c2be5be438e265f41c66f05abe1a3
https://doi.org/10.23919/empc44848.2019.8951758