يعرض 1 - 10 نتائج من 800 نتيجة بحث عن '"Singh, Prashant Kumar"', وقت الاستعلام: 1.37s تنقيح النتائج
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    مؤتمر

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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    مؤتمر

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-10 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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    مؤتمر

    المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023

    Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

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    دورية أكاديمية
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    كتاب إلكتروني

    المساهمون: Kacprzyk, Janusz, Series EditorAff1, Gomide, Fernando, Advisory EditorAff2, Kaynak, Okyay, Advisory EditorAff3, Liu, Derong, Advisory EditorAff4, Pedrycz, Witold, Advisory EditorAff5, Polycarpou, Marios M., Advisory EditorAff6, Rudas, Imre J., Advisory EditorAff7, Wang, Jun, Advisory EditorAff8, Kumar, Sandeep, editorAff9, Balachandran, K., editorAff10, Kim, Joong Hoon, editorAff11, Bansal, Jagdish Chand, editorAff12

    المصدر: Fourth Congress on Intelligent Systems : CIS 2023, Volume 2. 869:131-141

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    كتاب إلكتروني

    المساهمون: Kumar, Rohtash, editorAff1, Singh, Raghav, editorAff2, Kanhaiya, Shyam, editorAff3, Maurya, Satya Prakash, editorAff4

    المصدر: Recent Developments in Earthquake Seismology : Present and Future of Seismological Analysis. :25-45

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    كتاب إلكتروني

    المساهمون: Gupta, Vijai Kumar, Series EditorAff1, Tuohy, Maria G., Series EditorAff2, Singh, Bhim Pratap, editorAff3, Abdel-Azeem, Ahmed M., editorAff4, Gautam, Vibhav, editorAff5, Singh, Garima, editorAff6, Singh, Santosh Kumar, editorAff7

    المصدر: Endophytic Fungi : The Hidden Sustainable Jewels for the Pharmaceutical and Agricultural Industries. :279-294

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    دورية أكاديمية
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    دورية أكاديمية

    المؤلفون: Verma, AyushAff1, Aff2, Chauhan, Lakshay, Kumar, T. SudeepAff1, Aff3, Singh, Prashant Kumar, Dommeti, Satya Gowtam, Thangaraju, ShanmugasundaramAff1, IDs1183702305861z_cor6

    المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 75(7):2701-2713