المؤلفون: Phoka, Andri, van den Bemt, Bart J. F.^{Aff2, Aff3}, Lubrano, Ennio^{Aff4, Aff5}, Singh, Inderjit, Fernández-Carballido, Cristina, Parow, Detlev, Webb, Dale, Lacombe, Fabienne, Harrington, Laura, Baraliakos, Xenofon^{Aff12, IDs40744024006634_cor10}

المصدر: Rheumatology and Therapy. 11(3):773-794

المؤلفون: Ramasamy, Anandan, Singh, Inderjit, Ng, Ace, Low, Shin, Maloney, Gerry, Shao, Alan

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :730-733 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Shao, Shuai Alan, Chen, Shih-Yen Stan, Lee, Chien-Wei Ken, Chen, Yi-Ting Henry, Low, Shin, Singh, Inderjit

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1095-1102 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Singh, Inderjit^Aff39, Raj, Balwinder^Aff39, Khosla, Mamta^Aff39

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Chakraborty, Samarjit, Series Editor^Aff3, Chen, Jiming, Series Editor^Aff4, Chen, Shanben, Series Editor^Aff5, Chen, Tan Kay, Series Editor^Aff6, Dillmann, Rüdiger, Series Editor^Aff7, Duan, Haibin, Series Editor^Aff8, Ferrari, Gianluigi, Series Editor^Aff9, Ferre, Manuel, Series Editor^Aff10, Jabbari, Faryar, Series Editor^Aff11, Jia, Limin, Series Editor^Aff12, Kacprzyk, Janusz, Series Editor^Aff13, Khamis, Alaa, Series Editor^Aff14, Kroeger, Torsten, Series Editor^Aff15, Li, Yong, Series Editor^Aff16, Liang, Qilian, Series Editor^Aff17, Martín, Ferran, Series Editor^Aff18, Ming, Tan Cher, Series Editor^Aff19, Minker, Wolfgang, Series Editor^Aff20, Misra, Pradeep, Series Editor^Aff21, Mukhopadhyay, Subhas, Series Editor^Aff22, Ning, Cun-Zheng, Series Editor^Aff23, Nishida, Toyoaki, Series Editor^Aff24, Oneto, Luca, Series Editor^Aff25, Panigrahi, Bijaya Ketan, Series Editor^Aff26, Pascucci, Federica, Series Editor^Aff27, Qin, Yong, Series Editor^Aff28, Seng, Gan Woon, Series Editor^Aff29, Speidel, Joachim, Series Editor^Aff30, Veiga, Germano, Series Editor^Aff31, Wu, Haitao, Series Editor^Aff32, Zamboni, Walter, Series Editor^Aff33, Zhang, Junjie James, Series Editor^Aff34, Tan, Kay Chen, Series Editor^Aff35, Mehta, Gayatri, editor^Aff36, Wickramasinghe, Nilmini, editor^Aff37, Kakkar, Deepti, editor^Aff38

المصدر: Innovations in VLSI, Signal Processing and Computational Technologies : Select Proceedings of the 2nd International Conference, WREC 2023. 1095:13-24

المؤلفون: Choudhary, Raman, Dhakad, Ashok K., Singh, Inderjit, Singh, Avtar, Dhillon, G. P. S., Gill, Rishi I. S.^{Aff2, IDs1072202401911w_cor6}

المصدر: Genetic Resources and Crop Evolution: An International Journal. :1-14

المؤلفون: Bakala, Harmeet Singh, Devi, Jomika, Singh, Gurjeet^{Aff1, Aff2, IDs00425024044016_cor3}, Singh, Inderjit

المصدر: Planta: An International Journal of Plant Biology. 259(5)

المؤلفون: Johal, Norah^{Aff1, IDs4050202300740w_cor1}, Kaur, Jagmeet, Vikal, Yogesh, Yadav, Inderjit, Singh, Sarvjeet, Singh, Inderjit

المصدر: Plant Physiology Reports: Formerly known as 'Indian Journal of Plant Physiology'. 28(3):378-387

المؤلفون: Ramasamy, Anandan, Singh, Inderjit, Low, Shin, Lin, Bryant

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :53-56 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ramasamy, Anandan, Singh, Inderjit, Low, Shin, Lin, Bryant

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :79-82 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Bindra, Shayla^Aff7, Sharma, Shubham^Aff7, Sharma, Arpana^Aff8, Rani, Upasana^Aff7, Singh, Inderjit^Aff7, Bharadwaj, Chellapilla^Aff9, Singh, Sarvjeet^Aff7

المساهمون: Jha, Uday Chand, editor^Aff1, Nayyar, Harsh, editor^Aff2, Sharma, Kamal Dev, editor^Aff3, von Wettberg, Eric J Bishop, editor^Aff4, Singh, Prashant, editor^Aff5, Siddique, Kadambot H.M, editor^Aff6

المصدر: Diseases in Legume Crops : Next Generation Breeding Approaches for Resistant Legume Crops. :31-60