يعرض 1 - 10 نتائج من 346 نتيجة بحث عن '"Singh Navab"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    مؤتمر
    Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding

    المؤلفون: Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Sandra, San, Van Nhat Anh, Tran, Chandra Rao, Bhesetti, Guan, Chen Gim, Haitao, Yu, Raju, Mani, Ping, Luo, Chaeeun, Lee, Rao, Vempati Srinivasa, Singh, Navab

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :803-808 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications

    المؤلفون: Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1880-1884 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Cu/Dielectric hybrid bonding among Glass and Si

    المؤلفون: Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Van Nhat Anh, Tran, Jae Ok, Yoo, Rao, Vempati Srinivasa, Singh, Navab

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1543-1547 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    1 Million Intrinsic Q-Factor Microring Resonators From PVD Aluminum Nitride on SiO2-on-Si Substrate

    المؤلفون: Tong, Amy S. K., Wai Chung, Wing, Goh, Charmaine, Tobing, Landobasa Y. M., Woon Lim, Leh, Akimov, Yuriy A., Jiang Quek, Zhan, Anthur, Aravind P., Sheng Goh, Jia, Lin, Huamao, Singh, Navab, Zhang, Qingxin, Ng, Doris K. T.

    المصدر: 2024 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2024. :1-3 Mar, 2024

    Relation: 2024 Optical Fiber Communications Conference and Exhibition (OFC)

    أضف إلى المفضلة
  5. 5
    دورية أكاديمية
    Large-area metasurface on CMOS-compatible fabrication platform: driving flat optics from lab to fab

    المؤلفون: Li Nanxi, Xu Zhengji, Dong Yuan, Hu Ting, Zhong Qize, Fu Yuan Hsing, Zhu Shiyang, Singh Navab

    المصدر: Nanophotonics, Vol 9, Iss 10, Pp 3071-3087 (2020)

    مصطلحات موضوعية: large area, metasurface, flat optics, lithography, Physics, QC1-999

    وصف الملف: electronic resource

    Relation: https://doaj.org/toc/2192-8606; https://doaj.org/toc/2192-8614

    URL الوصول: https://doaj.org/article/23c3636fc45b4925a4eb672f06590df3

    Find this article in full text from ProQuest Full Text Finder
    أضف إلى المفضلة
  6. 6
    دورية أكاديمية
    CMOS-compatible a-Si metalenses on a 12-inch glass wafer for fingerprint imaging

    المؤلفون: Hu Ting, Zhong Qize, Li Nanxi, Dong Yuan, Xu Zhengji, Fu Yuan Hsing, Li Dongdong, Bliznetsov Vladimir, Zhou Yanyan, Lai Keng Heng, Lin Qunying, Zhu Shiyang, Singh Navab

    المصدر: Nanophotonics, Vol 9, Iss 4, Pp 823-830 (2020)

    مصطلحات موضوعية: metasurface, glass wafer, metalens, Physics, QC1-999

    وصف الملف: electronic resource

    Relation: https://doaj.org/toc/2192-8614

    URL الوصول: https://doaj.org/article/eaee9ffc5ce34a3d9bc464617521bdcc

    Find this article in full text from ProQuest Full Text Finder
    أضف إلى المفضلة
  7. 7
    مؤتمر
    Defect evolution during through-silicon via copper electroplating and methods for robust void-free filling

    المؤلفون: Van Nhat Anh, Tran, Venkataraman, Nandini, Tao, Meng, Ya-Ching, Tseng, Xiangyu, Wang, King-Jien, Chui, Singh, Navab, Rao, Vempati Srinivasa

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1059-1062 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  8. 8
    مؤتمر
    Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding

    المؤلفون: Roy, Sangita Chaki, Guan, Chen Gim, Venkataraman, Nandini, Lee, Wen, Singh, Navab

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :135-138 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  9. 9
    مؤتمر
    Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding

    المؤلفون: Cheemalamarri, Hemanth Kumar, Lir, Ji, Lee, Wen, Rao, Vempati Srinivasa, Singh, Navab

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :493-497 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  10. 10
    مؤتمر
    Ultrathin New Dielectric Interlayer Layer - Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications

    المؤلفون: Cheemalamarri, Hemanth Kumar, Lee Hou Jang, Steven, Miao, Ji Hong, V, Nandini, S, Chandra Rao B S, King Jien, Chui, Rao, Vempati Srinivasa, Singh, Navab

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :625-628 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء