المؤلفون: Moreno, G., Narumanchi, S., Tomerlin, J., Major, J.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 37(10):12474-12485 Oct, 2022

المؤلفون: Joshi, Shailesh N., Yu, Ziqi, Sennoun, Hacin, Hampshire, Joseph, Dede, Ercan M.

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :790-795 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Adinarayana, K. N. V.^{Aff12, Aff13}, Ali, Seik Mansoor^Aff13, Rao, P. Mangarjuna^{Aff12, Aff14}

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Cavas-Martínez, Francisco, Editorial Board Member^Aff4, di Mare, Francesca, Editorial Board Member^Aff5, Haddar, Mohamed, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Bhattacharyya, Suvanjan, editor^Aff9, Verma, Saket, editor^Aff10, Harikrishnan, A. R., editor^Aff11

المصدر: Fluid Mechanics and Fluid Power (Vol. 3) : Select Proceedings of FMFP 2021. :257-262

المؤلفون: T. Prevost, S. Battaglioli, R. Jenkins, A.J. Robinson

المصدر: International Journal of Thermofluids, Vol 16, Iss , Pp 100203- (2022)

مصطلحات موضوعية: Jet impingement, Jet arrays, Enhanced heat transfer, Single phase heat transfer, Heat, QC251-338.5

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666202722000672; https://doaj.org/toc/2666-2027

URL الوصول: https://doaj.org/article/39d0d5abb94743bc8f5066dd32afb73d

المؤلفون: Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Leblebici, Y., Wunderle, B., Reichl, H.

المصدر: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-12 Jun, 2010

Relation: 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المساهمون: McKrell, Thomas [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)]

المصدر: Journal of Heat Transfer; 138; 2

وصف الملف: Medium: ED; Size: Article No. 021704

URL الوصول: http://www.osti.gov/scitech/servlets/purl/1333837

المؤلفون: Persoons, T., Saenen, T., Donose, R., Baelmans, M.

المصدر: 2009 15th International Workshop on Thermal Investigations of ICs and Systems Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on. :163-167 Oct, 2009

Relation: 2009 15th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Toral, G., Temiz, Y., Leblebici, Y.

المصدر: 2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-10 Sep, 2009

Relation: 2009 IEEE International Conference on 3D System Integration (3DIC)

المؤلفون: Brunschwiler, Thomas, Michel, B., Rothuizen, Hugo, Kloter, U., Wunderle, B., Oppermann, H., Reichl, H.

المصدر: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on. :1114-1125 May, 2008

Relation: 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM)

المؤلفون: S. Subramanian, K. S. Sridhar, C. K. Umesh

المصدر: Journal of Applied Fluid Mechanics, Vol 12, Iss 3, Pp 647-655 (2019)

مصطلحات موضوعية: Microchannel testing, Modified hexagonal fins, Single phase heat transfer, Copper heat sinks, Laminar flow., Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: http://jafmonline.net/JournalArchive/download?file_ID=48986&issue_ID=256; https://doaj.org/toc/1735-3572

URL الوصول: https://doaj.org/article/8899bf8e8ee44da0b86abf4cec969a13