يعرض 1 - 5 نتائج من 5 نتيجة بحث عن '"Siqun Xiao"', وقت الاستعلام: 1.40s تنقيح النتائج
  1. 1
    مؤتمر
    Application of a new laser scanning pattern wafer inspection tool to leading edge memory and logic applications at Infineon Technologies

    المؤلفون: Reuter, T., Bohmler, U., Steck, S., McLaren, M., Siqun Xiao, Howland Pinto, R.

    المصدر: 10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) Semiconductor manufacturing 99 Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI. :314-320 1999

    Relation: 1999 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings

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  2. 2
    Process window improvement for fin cut layer in self-aligned double-patterning process based on backscattered electron imaging

    المؤلفون: Yu Zhang, David Wei Zhang, Yuyang Bian, Biqiu Liu, Cong Zhang, Jun Huang, Jiawang Song, Yang Gao, Qiang Zhou, Wei Chen, Siqun Xiao, Shmuel Ben Nissim, Kevin Houchens, Omri Baum, Amit Zakay, Tal Ayzik, Yaniv Abramovitz

    المصدر: Journal of Micro/Nanopatterning, Materials, and Metrology. 21

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::132931604fa8372bd4ac7cc9d438b449
    https://doi.org/10.1117/1.jmm.21.4.041605

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  3. 3
    In-line Monitor of Non-overlay Misalignment Defect by Dark-Field Inspection System

    المؤلفون: Hongbo Jiang, Sean Huang, He Huang, Wensheng Li, Yin Xiang, Siqun Xiao, Henry Chen

    المصدر: 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.

    مصطلحات موضوعية: Signal processing, Optics, Materials science, business.industry, Line (geometry), Reticle, Condition monitoring, Wafer, Overlay, business, Dark field microscopy, Metrology

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bfe4f04594e34d4675ca3f2a7aa2702c
    https://doi.org/10.1109/asmc.2008.4528999

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  4. 4
    Application of a new laser scanning pattern wafer inspection tool to leading edge memory and logic applications at Infineon Technologies

    المؤلفون: S. Steck, M. McLaren, Siqun Xiao, U. Bohmler, T. Reuter, R. Howland Pinto

    المصدر: 10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295).

    مصطلحات موضوعية: Process variation, Engineering, Laser scanning, CPU cache, business.industry, Electronic engineering, Microelectronics, Optoelectronics, Wafer, Sensitivity (control systems), business, AND gate, Die (integrated circuit)

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6517b616f0f6af87141d10c3fad349d6
    https://doi.org/10.1109/asmc.1999.798253

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  5. 5
    مؤتمر
    In-line Monitor of Non-overlay Misalignment Defect by Dark-Field Inspection System.

    المؤلفون: Sean Huang, Henry Chen, Wensheng Li, He Huang, Yin Xiang, Hongbo Jiang, Siqun Xiao

    المصدر: 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference; 2008, p15-18, 4p

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