يعرض 1 - 10 نتائج من 409 نتيجة بحث عن '"Slope factor"', وقت الاستعلام: 1.63s تنقيح النتائج
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    مؤتمر

    المصدر: 2022 19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON),. :1-4 May, 2022

    Relation: 2022 19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

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    مؤتمر

    المؤلفون: Berdin, Alexander, Kovalenko, Pavel

    المصدر: 2019 IEEE 60th International Scientific Conference on Power and Electrical Engineering of Riga Technical University (RTUCON) Power and Electrical Engineering of Riga Technical University (RTUCON), 2019 IEEE 60th International Scientific Conference on. :1-5 Oct, 2019

    Relation: 2019 IEEE 60th International Scientific Conference on Power and Electrical Engineering of Riga Technical University (RTUCON)

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    كتاب إلكتروني

    المؤلفون: Liberda, EricAff3, Sly, TimothyAff3

    المساهمون: Liberda, EricAff1, Sly, TimothyAff2

    المصدر: Assessment and Communication of Risk : A Pocket Text for Health and Safety Professionals. :69-156

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    كتاب إلكتروني

    المؤلفون: Shukla, Rajesh P.Aff12, Jakka, Ravi S.Aff13

    المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Muthukkumaran, Kasinathan, editorAff8, Reddy, C. N. V. Satyanarayana, editorAff9, Joseph, Anil, editorAff10, Senthamilkumar, S., editorAff11

    المصدر: Foundation and Forensic Geotechnical Engineering : Proceedings of the Indian Geotechnical Conference 2021 Volume 2. 295:217-227

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    مؤتمر

    المصدر: 2017 47th European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2017 47th European. :62-65 Sep, 2017

    Relation: ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC)

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    كتاب إلكتروني

    المؤلفون: Huang, YanAff39

    المساهمون: Angrisani, Leopoldo, Series EditorAff1, Arteaga, Marco, Series EditorAff2, Panigrahi, Bijaya Ketan, Series EditorAff3, Chakraborty, Samarjit, Series EditorAff4, Chen, Jiming, Series EditorAff5, Chen, Shanben, Series EditorAff6, Chen, Tan Kay, Series EditorAff7, Dillmann, Rüdiger, Series EditorAff8, Duan, Haibin, Series EditorAff9, Ferrari, Gianluigi, Series EditorAff10, Ferre, Manuel, Series EditorAff11, Hirche, Sandra, Series EditorAff12, Jabbari, Faryar, Series EditorAff13, Jia, Limin, Series EditorAff14, Kacprzyk, Janusz, Series EditorAff15, Khamis, Alaa, Series EditorAff16, Kroeger, Torsten, Series EditorAff17, Li, Yong, Series EditorAff18, Liang, Qilian, Series EditorAff19, Martín, Ferran, Series EditorAff20, Ming, Tan Cher, Series EditorAff21, Minker, Wolfgang, Series EditorAff22, Misra, Pradeep, Series EditorAff23, Möller, Sebastian, Series EditorAff24, Mukhopadhyay, Subhas, Series EditorAff25, Ning, Cun-Zheng, Series EditorAff26, Nishida, Toyoaki, Series EditorAff27, Pascucci, Federica, Series EditorAff28, Qin, Yong, Series EditorAff29, Seng, Gan Woon, Series EditorAff30, Speidel, Joachim, Series EditorAff31, Veiga, Germano, Series EditorAff32, Wu, Haitao, Series EditorAff33, Zamboni, Walter, Series EditorAff34, Zhang, Junjie James, Series EditorAff35, Hung, Jason C., editorAff36, Yen, Neil Y., editorAff37, Chang, Jia-Wei, editorAff38

    المصدر: Frontier Computing : Proceedings of FC 2021. 827:1349-1355

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