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1مؤتمر
المؤلفون: Baek, Kyungmin, Han, Min-soo, Han, Il Young, Shin Lee, Jung, Sim, Jaeuk, Lee, Joongha, Min, Daeho, Lim, Kyeongbin, Rhee, Minwoo Daniel
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1256-1259 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2تقرير
المؤلفون: Kim, Jinuk, Oh, Seung-hoon, Yang, Daeho, Kim, Junki, Lee, Moonjoo, An, Kyungwon
المصدر: Nat. Photon. 16, 707 (2022)
مصطلحات موضوعية: Quantum Physics, Physics - Atomic Physics, Physics - Optics
URL الوصول: http://arxiv.org/abs/2406.15710
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3
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4مؤتمر
المؤلفون: Yun, Daeho, Park, Minsu, Kim, Kahyun, Baek, Kyungmin, Lee, Eonhui, Choi, Woo-Seok, Jeong, Deog-Kyoon
المصدر: 2023 IEEE Asian Solid-State Circuits Conference (A-SSCC) Solid-State Circuits Conference (A-SSCC), 2023 IEEE Asian. :1-3 Nov, 2023
Relation: 2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)
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5مؤتمر
المؤلفون: Kim, Kahyun, Yun, Daeho, Baek, Kyungmin, Choi, Woo-Seok, Jeong, Deog-Kyoon
المصدر: 2023 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2023 IEEE International Symposium on. :1-5 May, 2023
Relation: 2023 IEEE International Symposium on Circuits and Systems (ISCAS)
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6دورية أكاديمية
المؤلفون: Khargotra, RohitAff1, Aff5, Kumar, Sushil, Singh, Tej, Lee, DaehoAff4, IDs10973024132215_cor4, Kumar, RajAff4, IDs10973024132215_cor5
المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(12):6459-6481
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7تقرير
المؤلفون: Yoo, Hyuk Jun, Kim, Nayeon, Lee, Heeseung, Kim, Daeho, Ow, Leslie Tiong Ching, Nam, Hyobin, Kim, Chansoo, Lee, Seung Yong, Lee, Kwan-Young, Kim, Donghun, Han, Sang Soo
مصطلحات موضوعية: Physics - Chemical Physics, Computer Science - Machine Learning
URL الوصول: http://arxiv.org/abs/2309.00349
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8مؤتمر
المؤلفون: Kim, Jinwoo, Kim, Daeho, Lee, SangHyun
المصدر: 2022 Winter Simulation Conference (WSC) Winter Simulation Conference (WSC), 2022. :2421-2428 Dec, 2022
Relation: 2022 Winter Simulation Conference (WSC)
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9دورية أكاديمية
المؤلفون: Kumar, Raj, Lee, DaehoAff1, IDs10973023128319_cor2, Ağbulut, ÜmitAff2, IDs10973023128319_cor3, Kumar, Sushil, Thapa, Sashank, Thakur, Abhishek, Jilte, R. D., Saleel, C. Ahamed, Shaik, Saboor
المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(5):1895-1933
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10دورية أكاديمية
المؤلفون: Kumar, Sushil, Kumar, RajAff2, IDs10973023128364_cor2, Thakur, Robin, Kumar, Sushil, Lee, DaehoAff2, IDs10973023128364_cor5
المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(5):2273-2291