المؤلفون: Park, Sang-Soo, Kim, KyungSoo, So, Jinin, Jung, Jin, Lee, Jonggeon, Woo, Kyoungwan, Kim, Nayeon, Lee, Younghyun, Kim, Hyungyo, Kwon, Yongsuk, Kim, Jinhyun, Lee, Jieun, Cho, YeonGon, Tai, Yongmin, Cho, Jeonghyeon, Song, Hoyoung, Ahn, Jung Ho, Kim, Nam Sung

المصدر: 2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2024 IEEE International Symposium on. :970-982 Mar, 2024

Relation: 2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA)

المؤلفون: Kim, Jin Hyun, Ro, Yuhwan, So, Jinin, Lee, Sukhan, Kang, Shin-haeng, Cho, YeonGon, Kim, Hyeonsu, Kim, Byeongho, Kim, Kyungsoo, Park, Sangsoo, Kim, Jin-Seong, Cha, Sanghoon, Lee, Won-Jo, Jung, Jin, Lee, Jong-Geon, Lee, Jieun, Song, JoonHo, Lee, Seungwon, Cho, Jeonghyeon, Yu, Jaehoon, Sohn, Kyomin

المصدر: 2023 IEEE Hot Chips 35 Symposium (HCS) Hot Chips 35 Symposium (HCS), 2023 IEEE. :1-31 Aug, 2023

Relation: 2023 IEEE Hot Chips 35 Symposium (HCS)

المؤلفون: Bhandari, Jugal Kishore, Rajeswari, Divya Sri, Ramana, Pamidighantam V, Yeluripati, Rohin Kumar, Ubed, Mohammed, Jose, Jinin K, Veerandi, Anusha, Dharavath, Sandhya

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1908-1912 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kim, Jin Hyun, Kang, Shin-haeng, Lee, Sukhan, Kim, Hyeonsu, Song, Woongjae, Ro, Yuhwan, Lee, Seungwon, Wang, David, Shin, Hyunsung, Phuah, Bengseng, Choi, Jihyun, So, Jinin, Cho, YeonGon, Song, JoonHo, Choi, Jangseok, Cho, Jeonghyeon, Sohn, Kyomin, Sohn, Youngsoo, Park, Kwangil, Kim, Nam Sung

المصدر: 2021 IEEE Hot Chips 33 Symposium (HCS) Hot Chips 33 Symposium (HCS), 2021 IEEE. :1-26 Aug, 2021

Relation: 2021 IEEE Hot Chips 33 Symposium (HCS)

المؤلفون: Joo, JinWon, Yoon, Minyong, Choi, Jungwook, Kang, Mingu, Lee, JongGeon, So, JinIn, Yun, IlKwon, Kwon, Yongsuk, Kim, KyungSoo

المصدر: 2021 18th International SoC Design Conference (ISOCC) SoC Design Conference (ISOCC), 2021 18th International. :413-414 Oct, 2021

Relation: 2021 18th International SoC Design Conference (ISOCC)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Kyungsan Kim, Hyunseok Kim, Jinin So, Wonjae Lee, Junhyuk Im, Sungjoo Park, Jeonghyeon Cho, Hoyoung Song

المصدر: IEEE Micro. 43:20-29

مصطلحات موضوعية: Hardware and Architecture, Electrical and Electronic Engineering, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cbb3ba93f352e840a9e9572f8075397d
https://doi.org/10.1109/mm.2023.3240774

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Jin Hyun Kim, Shin-Haeng Kang, Sukhan Lee, Hyeonsu Kim, Yuhwan Ro, Seungwon Lee, David Wang, Jihyun Choi, Jinin So, YeonGon Cho, JoonHo Song, Jeonghyeon Cho, Kyomin Sohn, Nam Sung Kim

المصدر: IEEE Micro. 42:20-30

مصطلحات موضوعية: Hardware and Architecture, Electrical and Electronic Engineering, Software

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a65ffa503be2a8ea09c2ee81fa48aca8
https://doi.org/10.1109/mm.2022.3164651

المؤلفون: Hsien-Hsin S. Lee, Il-Kwon Yun, Jin Jung, Jong Geon Lee, Jinin So, Shin-haeng Kang, Liu Ke, Joon-Ho Song, Xuan Zhang, Han Songyi, Kyomin Sohn, Jin-Hyun Kim, Sukhan Lee, Jeonghyeon Cho, Kyung-Soo Kim, Yeongon Cho, Hyunsun Park, Yongsuk Kwon, Sung Joo Park, Nam Sung Kim

المصدر: IEEE Micro. 42:116-127

مصطلحات موضوعية: Speedup, Computer architecture, Hardware and Architecture, Computer science, Scalability, Bandwidth (computing), Electrical and Electronic Engineering, DIMM, Field-programmable gate array, Throughput (business), Software, Dram, Bottleneck

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7cc9b11690dd9b0d1cce4b743bb39f1f
https://doi.org/10.1109/mm.2021.3097700