المؤلفون: Soestbergen, M. van, Roucou, R., Rebosolan, M., M Zaal, J.J.

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Zawra, I., Umunnakwe, C. B., Soestbergen, M. van, Rudnyi, E. B., Bechtold, T.

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Soestbergen, M. van, Zaal, J.J.M., Roucou, R., Jiang, Q., Dasgupta, A.

المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-4 Jul, 2020

Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Aree-Uea, A., Mavinkurve, A., Soestbergen, M. van, Rongen, R.T.H.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :219-224 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Soestbergen, M. van

المصدر: Progress in Organic Coatings, 10, 77, 1562-1568

مصطلحات الفهرس: Architecture, Cerium dibutylphosphate, Corrosion inhibitor, Leaching, Organic coating, pH effect, Cerium, Cerium compounds, Corrosion inhibitors, Epoxy resins, Experiments, Fourier transform infrared spectroscopy, Magnetic resonance imaging, Organic coatings, pH effects, Scanning electron microscopy, Stripping (removal), Aqueous environment, Coating system, Epoxy coatings, Fourier transform spectroscopy, Highly loaded, Leaching behavior, Leaching experiments, Porous networks, Loading, Buildings and Infrastructure, Built Environment, Building Engineering & Civil Engineering, SR - Structural Reliability, TS - Technical Sciences, article

URL: http://resolver.tudelft.nl/uuid:39cdaeb0-6dc4-4702-b532-5ef776726f91