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1مؤتمر
المؤلفون: Mun, Seong Yeol, Cho, J., Zhu, B., Agnihotri, P., Wong, C. Y., Lee, T. J., Mahajan, V., Liu, B. W., Shi, Y. J., Hong, W., Ciavatti, J., Lee, J. G., Samavedam, S. B., Sohn, D. K.
المصدر: 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2018 IEEE International Conference on. :153-156 Mar, 2018
Relation: 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)
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2مؤتمر
المؤلفون: Togo, M., Asra, R., Balasubramaniam, P., Zhang, X., Yu, H., Yamaguchi, S., Geiss, E., Yang, H. S., Cohen, B., Lo, H-C., Hu, O., Lazar, H., Kwon, O., Burnett, D., Versaggi, J., Banghart, E., Hassan, M. K., Bazizi, E., Pantisano, L., Lee, J. G., Samavedam, S. B., Sohn, D. K.
المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :81-82 Jun, 2018
Relation: 2018 IEEE Symposium on VLSI Technology
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3مؤتمر
المؤلفون: Mun, S. Y., Burnett, D., Lim, K. Y., Parihar, S., Shi, Y. J., Lo, H. C., Hong, W., Lee, K. J., Hu, O., Versaggi, J., Jerome, C., Lee, J. G., Samavedam, S. B., Sohn, D. K.
المصدر: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017 IEEE. :1-2 Oct, 2017
Relation: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
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4مؤتمر
المؤلفون: Singh, J., Bousquet, A., Ciavatti, J., Sundaram, K., Wong, J. S., Chew, K. W., Bandyopadhyay, A., Li, S., Bellaouar, A., Pandey, S. M., Zhu, B., Martin, A., Kyono, C., Goo, J.-S., Yang, H. S., Mehta, A., Zhang, X., Hu, O., Mahajan, S., Geiss, E., Yamaguchi, S., Mittal, S., Asra, R., Balasubramaniam, P., Watts, J., Harame, D., Todi, R. M., Samavedam, S. B., Sohn, D. K.
المصدر: 2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T140-T141 Jun, 2017
Relation: 2017 Symposium on VLSI Technology
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5مؤتمر
المؤلفون: He, X., Fronheiser, J., Zhao, P., Hu, Z., Uppal, S., Wu, X., Hu, Y., Sporer, R., Qin, L., Krishnan, R., Bazizi, E. M., Carter, R., Tabakman, K., Jha, A. K., Yu, H., Hu, O., Choi, D., Lee, J. G., Samavedam, S. B., Sohn, D. K.
المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :20.2.1-20.2.4 Dec, 2017
Relation: 2017 IEEE International Electron Devices Meeting (IEDM)
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6مؤتمر
المؤلفون: Narasimha, S., Jagannathan, B., Ogino, A., Jaeger, D., Greene, B., Sheraw, C., Zhao, K., Haran, B., Kwon, U., Mahalingam, A. K. M., Kannan, B., Morganfeld, B., Dechene, J., Radens, C., Tessier, A., Hassan, A., Narisetty, H., Ahsan, I., Aminpur, M., An, C., Aquilino, M., Arya, A., Augur, R., Baliga, N., Bhelkar, R., Biery, G., Blauberg, A., Borjemscaia, N., Bryant, A., Cao, L., Chauhan, V., Chen, M., Cheng, L., Choo, J., Christiansen, C., Chu, T., Cohen, B., Coleman, R., Conklin, D., Crown, S., da Silva, A., Dechene, D., Derderian, G., Deshpande, S., Dilliway, G., Donegan, K., Eller, M., Fan, Y., Fang, Q., Gassaria, A., Gauthier, R., Ghosh, S., Gifford, G., Gordon, T., Gribelyuk, M., Han, G., Han, J.H., Han, K., Hasan, M., Higman, J., Holt, J., Hu, L., Huang, L., Huang, C., Hung, T., Jin, Y., Johnson, J., Johnson, S., Joshi, V., Joshi, M., Justison, P., Kalaga, S., Kim, T., Kim, W., Krishnan, R., Krishnan, B., Anil, K., Kumar, M., Lee, J., Lee, R., Lemon, J., Liew, S.L., Lindo, P., Lingalugari, M., Lipinski, M., Liu, P., Liu, J., Lucarini, S., Ma, W., Maciejewski, E., Madisetti, S., Malinowski, A., Mehta, J., Meng, C., Mitra, S., Montgomery, C., Nayfeh, H., Nigam, T., Northrop, G., Onishi, K., Ordonio, C., Ozbek, M., Pal, R., Parihar, S., Patterson, O., Ramanathan, E., Ramirez, I., Ranjan, R., Sarad, J., Sardesai, V., Saudari, S., Schiller, C., Senapati, B., Serrau, C., Shah, N., Shen, T., Sheng, H., Shepard, J., Shi, Y., Silvestre, M.C., Singh, D., Song, Z., Sporre, J., Srinivasan, P., Sun, Z., Sutton, A., Sweeney, R., Tabakman, K., Tan, M., Wang, X., Woodard, E., Xu, G., Xu, D., Xuan, T., Yan, Y., Yang, J., Yeap, K.B., Yu, M., Zainuddin, A., Zeng, J., Zhang, K., Zhao, M., Zhong, Y., Carter, R., Lin, C.-H., Grunow, S., Child, C., Lagus, M., Fox, R., Kaste, E., Gomba, G., Samavedam, S., Agnello, P., Sohn, D. K.
المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :29.5.1-29.5.4 Dec, 2017
Relation: 2017 IEEE International Electron Devices Meeting (IEDM)
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7دورية أكاديمية
المؤلفون: Ong, Y. Y., Ho, S. W., Sekhar, V. N., Ong, X., Ong, J., Zhang, X., Vaidyanathan, K., Yoon, S. U., Lau, J. H., Kheng, L. Y., Yeo, D., Chan, K. C., Zhang, Y., Tan, J. B., Sohn, D. K.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(3):279-290 Mar, 2011
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8دورية أكاديمية
المؤلفون: Ong, J. M. G., Tay, A. A. O., Zhang, X., Kripesh, V., Lim, Y. K., Yeo, D., Chan, K. C., Tan, J. B., Hsia, L. C., Sohn, D. K.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(4):838-848 Dec, 2009
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9دورية أكاديمية
المؤلفون: Lee, S.-H., Baek, C.-K., Park, S., Kim, D.-W., Sohn, D. K., Lee, J.-S., Kim, D. M., Jeong, Y.-H.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 33(10):1348-1350 Oct, 2012
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10مؤتمر
المؤلفون: Ong, J. M. G., Tay, Andrew A. O., Zhang, X., Kripesh, V., Lim, Y. K., Tan, J.B, Sohn, D. K.
المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :1031-1035 May, 2008
Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)