المؤلفون: Mun, Seong Yeol, Cho, J., Zhu, B., Agnihotri, P., Wong, C. Y., Lee, T. J., Mahajan, V., Liu, B. W., Shi, Y. J., Hong, W., Ciavatti, J., Lee, J. G., Samavedam, S. B., Sohn, D. K.

المصدر: 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2018 IEEE International Conference on. :153-156 Mar, 2018

Relation: 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Togo, M., Asra, R., Balasubramaniam, P., Zhang, X., Yu, H., Yamaguchi, S., Geiss, E., Yang, H. S., Cohen, B., Lo, H-C., Hu, O., Lazar, H., Kwon, O., Burnett, D., Versaggi, J., Banghart, E., Hassan, M. K., Bazizi, E., Pantisano, L., Lee, J. G., Samavedam, S. B., Sohn, D. K.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :81-82 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology

المؤلفون: Mun, S. Y., Burnett, D., Lim, K. Y., Parihar, S., Shi, Y. J., Lo, H. C., Hong, W., Lee, K. J., Hu, O., Versaggi, J., Jerome, C., Lee, J. G., Samavedam, S. B., Sohn, D. K.

المصدر: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017 IEEE. :1-2 Oct, 2017

Relation: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Singh, J., Bousquet, A., Ciavatti, J., Sundaram, K., Wong, J. S., Chew, K. W., Bandyopadhyay, A., Li, S., Bellaouar, A., Pandey, S. M., Zhu, B., Martin, A., Kyono, C., Goo, J.-S., Yang, H. S., Mehta, A., Zhang, X., Hu, O., Mahajan, S., Geiss, E., Yamaguchi, S., Mittal, S., Asra, R., Balasubramaniam, P., Watts, J., Harame, D., Todi, R. M., Samavedam, S. B., Sohn, D. K.

المصدر: 2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T140-T141 Jun, 2017

Relation: 2017 Symposium on VLSI Technology

المؤلفون: He, X., Fronheiser, J., Zhao, P., Hu, Z., Uppal, S., Wu, X., Hu, Y., Sporer, R., Qin, L., Krishnan, R., Bazizi, E. M., Carter, R., Tabakman, K., Jha, A. K., Yu, H., Hu, O., Choi, D., Lee, J. G., Samavedam, S. B., Sohn, D. K.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :20.2.1-20.2.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Narasimha, S., Jagannathan, B., Ogino, A., Jaeger, D., Greene, B., Sheraw, C., Zhao, K., Haran, B., Kwon, U., Mahalingam, A. K. M., Kannan, B., Morganfeld, B., Dechene, J., Radens, C., Tessier, A., Hassan, A., Narisetty, H., Ahsan, I., Aminpur, M., An, C., Aquilino, M., Arya, A., Augur, R., Baliga, N., Bhelkar, R., Biery, G., Blauberg, A., Borjemscaia, N., Bryant, A., Cao, L., Chauhan, V., Chen, M., Cheng, L., Choo, J., Christiansen, C., Chu, T., Cohen, B., Coleman, R., Conklin, D., Crown, S., da Silva, A., Dechene, D., Derderian, G., Deshpande, S., Dilliway, G., Donegan, K., Eller, M., Fan, Y., Fang, Q., Gassaria, A., Gauthier, R., Ghosh, S., Gifford, G., Gordon, T., Gribelyuk, M., Han, G., Han, J.H., Han, K., Hasan, M., Higman, J., Holt, J., Hu, L., Huang, L., Huang, C., Hung, T., Jin, Y., Johnson, J., Johnson, S., Joshi, V., Joshi, M., Justison, P., Kalaga, S., Kim, T., Kim, W., Krishnan, R., Krishnan, B., Anil, K., Kumar, M., Lee, J., Lee, R., Lemon, J., Liew, S.L., Lindo, P., Lingalugari, M., Lipinski, M., Liu, P., Liu, J., Lucarini, S., Ma, W., Maciejewski, E., Madisetti, S., Malinowski, A., Mehta, J., Meng, C., Mitra, S., Montgomery, C., Nayfeh, H., Nigam, T., Northrop, G., Onishi, K., Ordonio, C., Ozbek, M., Pal, R., Parihar, S., Patterson, O., Ramanathan, E., Ramirez, I., Ranjan, R., Sarad, J., Sardesai, V., Saudari, S., Schiller, C., Senapati, B., Serrau, C., Shah, N., Shen, T., Sheng, H., Shepard, J., Shi, Y., Silvestre, M.C., Singh, D., Song, Z., Sporre, J., Srinivasan, P., Sun, Z., Sutton, A., Sweeney, R., Tabakman, K., Tan, M., Wang, X., Woodard, E., Xu, G., Xu, D., Xuan, T., Yan, Y., Yang, J., Yeap, K.B., Yu, M., Zainuddin, A., Zeng, J., Zhang, K., Zhao, M., Zhong, Y., Carter, R., Lin, C.-H., Grunow, S., Child, C., Lagus, M., Fox, R., Kaste, E., Gomba, G., Samavedam, S., Agnello, P., Sohn, D. K.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :29.5.1-29.5.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Ong, Y. Y., Ho, S. W., Sekhar, V. N., Ong, X., Ong, J., Zhang, X., Vaidyanathan, K., Yoon, S. U., Lau, J. H., Kheng, L. Y., Yeo, D., Chan, K. C., Zhang, Y., Tan, J. B., Sohn, D. K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(3):279-290 Mar, 2011

المؤلفون: Ong, J. M. G., Tay, A. A. O., Zhang, X., Kripesh, V., Lim, Y. K., Yeo, D., Chan, K. C., Tan, J. B., Hsia, L. C., Sohn, D. K.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(4):838-848 Dec, 2009

المؤلفون: Lee, S.-H., Baek, C.-K., Park, S., Kim, D.-W., Sohn, D. K., Lee, J.-S., Kim, D. M., Jeong, Y.-H.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 33(10):1348-1350 Oct, 2012

المؤلفون: Ong, J. M. G., Tay, Andrew A. O., Zhang, X., Kripesh, V., Lim, Y. K., Tan, J.B, Sohn, D. K.

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :1031-1035 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)