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1مؤتمر
المؤلفون: Ha, Jonghwan, Deo, Karthik Arun, Yang, Junbo, Lai, Yangyang, Park, Seungbae
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1639-1643 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1131-1136 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المؤلفون: Lee, Tae-Kyu, Park, Yujin, Ramakrishna, Gnyaneshwar, Nam, Jonghyun, Yoon, Daljin, Roh, Heera
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1124-1130 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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4مؤتمر
المؤلفون: Jois, Chetan, Chou, Pei-En, Subbarayan, Ganesh
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1-4 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: Fettke, Matthias, Fisch, Anne, Geschke, Tom, Frick, Alexander, Alyasin, Khaled, Teutsch, Thorsten
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1298-1305 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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6مؤتمر
المؤلفون: Chakraborty, Souvik, Chen, Yaxiong, Sharma, Gaurav, Fahim, Abdullah, Hauck, Torsten, Das, Ronit, Mahmood, Atif, Suhling, Jeffrey C., Borgesen, Peter
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :506-513 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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7دورية أكاديمية
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(4):1285-1289 Aug, 2024
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8دورية أكاديمية
المؤلفون: Prasanna Prasad, S., Jois, C., Singh, Y., Subbarayan, G., Penmecha, B., Raghavan, P.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1308-1318 Jul, 2024
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9
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10مؤتمر
المؤلفون: Keranen, Kimmo, Kurkela, Timo, Ollila, Jyrki, Korkalainen, Marko, Tanskanen, Antti, Balin, Antoine, Buchholz, Arne, Mani, Anbarasan
المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024
Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)