المؤلفون: Illes, Balazs, Choi, Halim, Skwarek, Agata

المصدر: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2024. :1-8 Jan, 2024

Relation: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)

المؤلفون: Illes, Balazs, Choi, Halim, Skwarek, Agata

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Chen, Y. C., Chang, F. L., Chuang, M. C., Su, Y. C., Kao, C. R.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :205-206 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Son, Bongchan, Chae, Seung-Hyun, Noh, Seungkwon, Lee, KilJae, Kim, Sangdeok

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1291-1296 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Parvej, Sharma, Apurbba Kumar^{Aff1, IDs11665024097329_cor2}

المصدر: Journal of Materials Engineering and Performance. :1-13

المؤلفون: Hohne, Robert, Meier, Karsten, Reim, Michael, Lehmann, Marco, Bock, Karl-Heinz

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-4 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Rous, Pavel, Pribek, Petr, Steiner, Frantisek

المصدر: 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) Diagnostics in Electrical Engineering (Diagnostika), 2022 International Conference on. :1-5 Sep, 2022

Relation: 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika)

المؤلفون: Hu, Fengming, Huang, Feifei, Yan, Yan, Fang, Chao, Wang, Yunpeng, Huang, Mingliang

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Guo, Xiaotong, Xie, Fengjie, Zuo, Xinlang, Li, Yong, Tian, Ruyu, Liu, Jiahao, Wang, Ganqiang

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Ruiz-Jacinto, Vicente-Segundo, Gutiérrez-Valverde, Karina-Silvana, Aslla-Quispe, Abrahan-Pablo, Burga-Falla, José-Manuel, Alarcón-Sucasaca, Aldo, Huamán-Romaní, Yersi-Luis

المصدر: Soldering & Surface Mount Technology, 2023, Vol. 36, Issue 2, pp. 69-79.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2023-0045