المؤلفون: Kim, You-Gwon, Kim, Heon-Su, Kim, Tae-Wan, Ryu, Seoung-Ung, Kim, Hak-Sung, Jang, Yong-Rae, Han, Bongtae, Lee, Jun-Hyeong, Kim, Jin-Kyu

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2261-2266 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Ghafi, Esmaeil Kavousi, Lang, Oliver, Wagner, Matthias, Melzer, Alexander, Huemer, Mario

المصدر: 2024 IEEE Radar Conference (RadarConf24) Radar Conference (RadarConf24), 2024 IEEE. :1-6 May, 2024

Relation: 2024 IEEE Radar Conference (RadarConf24)

المؤلفون: Ren, Bo, Wu, C. T., Hu, Wei, Pan, Xiaofei, Lyu, Dandan, Chang, Norman

المصدر: 2023 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2023 IEEE International. :1-4 Oct, 2023

Relation: 2023 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ghafi, Esmaeil Kavousi, Lang, Oliver, Wagner, Matthias, Melzer, Alexander, Huemer, Mario

المصدر: 2023 18th Conference on Ph.D Research in Microelectronics and Electronics (PRIME) Ph.D Research in Microelectronics and Electronics (PRIME), 2023 18th Conference on. :45-48 Jun, 2023

Relation: 2023 18th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)

المؤلفون: Zhao, Tingting, Wei, Haoran, Ge, Haohui

المصدر: 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM) Integrated Circuits and Microsystems (ICICM), 2022 7th International Conference on. :110-118 Oct, 2022

Relation: 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM)

المؤلفون: Zhou, Pengcheng, Zhang, Yuyi, Liu, Yongkang, Chen, Zhuo, Wang, Fuliang, Zou, Changhui

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wu, Yue

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wu, Xiaopeng, Sun, Niuyi, Yang, Dan, Mei, Na, Sun, Tuobei

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Miao, Li, Zhaojun, Yang, Huidong, Song, Mingsheng, Cheng, Sen, Li

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Akoda, K. E., Guedon-Gracia, A., Lebraud, E., Deletage, J.-Y., Plano, B., Fremont, H.

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-6 Apr, 2022

Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)