يعرض 1 - 10 نتائج من 768 نتيجة بحث عن '"Solder bump"', وقت الاستعلام: 1.07s تنقيح النتائج
  1. 1
    مؤتمر
    A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications

    المؤلفون: Fettke, Matthias, Fisch, Anne, Geschke, Tom, Frick, Alexander, Alyasin, Khaled, Teutsch, Thorsten

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1298-1305 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package

    المؤلفون: Ryu, Seong-Ung, Park, Jong-Whi, Ju, Young-Min, Kim, Hak-Sung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2218-2222 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Integrated Process-Mechanical Stress Analysis of 2.5D/3D ICs with Two Types of Interconnections in Advanced Packaging

    المؤلفون: Ren, Bo, Wu, C. T., Hu, Wei, Pan, Xiaofei, Lyu, Dandan, Chang, Norman

    المصدر: 2023 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2023 IEEE International. :1-4 Oct, 2023

    Relation: 2023 IEEE International Integrated Reliability Workshop (IIRW)

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  4. 4
    مؤتمر
    On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations

    المؤلفون: Tippabhotla, Sasi Kumar, Ji, Lin

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :200-206 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Flip Chip Joining with Injection Molded Solder Technology

    المؤلفون: Hisada, Takashi, Aoki, Toyohiro

    المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023

    Relation: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  6. 6
    مؤتمر
    Mining EDS-EBSD Data to Study Microstructure of Solder Bump with Completely Unknown Intermetallics

    المؤلفون: Wu, Jiang, Choo, Eugene

    المصدر: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-4 Oct, 2022

    Relation: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)

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  7. 7
    مؤتمر
    Failure analysis and improvement research on high lead solder bump of flip chip FPGA for aerospace

    المؤلفون: Cao, Rui, Wu, Yaning, Zhu, Hengjing, Duan, Chao, Meng, Meng, Sun, Ming

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Finite Element Simulations of Flip Chip Solder Bumps with Fractures Present using FreeFem++

    المؤلفون: Ren, Hao, Zhou, Peng, Zhou, Chunming

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Flip Chip Typical Failure Case Analysis Research

    المؤلفون: Han, Jun, He, ZhiDan

    المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-6 Jul, 2022

    Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  10. 10
    مؤتمر
    Investigation of the crack propensity of co-extruded polypropylene based backsheets

    المؤلفون: Oreski, Gernot, Barretta, Chiara, Macher, Astrid, Eder, Gabriele, Neumaier, Lukas, Feichtner, Markus, Aarnio-Winterhof, Minna

    المصدر: 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC) Photovoltaics Specialists Conference (PVSC), 2022 IEEE 49th. :0485-0488 Jun, 2022

    Relation: 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC)

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