المؤلفون: Fahim, Abdullah, Zhang, Ryan, Mavinkurve, Amar, Shantaram, Sandeep, Adli, Ali Rezaie, Tanwongwan, Wiwat, Hauck, Torsten

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2062-2069 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: He, MJ, Ye, Rick, Pai, Yu Cheng, Wang, Yu-Po

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :143-144 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Lin, Rosa, Yip, Laurene, Lai, Charles, Lin, Bing-Yeh, Peng, Cooper, Syu, Chris, Chang, Melanie

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :277-282 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, Yangyang, Ye, Fenghua, Hu, Qianqian, Kang, Lei, Zhang, Sigai, Chen, Jiarun

المصدر: 2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI) Electronic Measurement & Instruments (ICEMI), 2021 IEEE 15th International Conference on. :259-263 Oct, 2021

Relation: 2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI)

المؤلفون: Yen, Freedman, Kao, Nicholas, Lai, David, Wang, Yu Po

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Lall, Pradeep, Ram, Aathi Raja, Suhling, Jeff, Deep, John

المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :708-718 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Tang, Ying, Wang, Xu, Chen, Honny, Sun, Kandy, Zhang, Cong

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Fahim, Abdullah, Hasan, Kamrul, Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :1302-1310 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Nazmus Sakib, A R, Lai, Richard S, Shantaram, Sandeep

المصدر: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1139-1145 May, 2019

Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Lim, W. Y. L.^Aff13, Mariatti, M.^Aff13, Ku Marsilla, K. I.^Aff13, Chan, W. K.^Aff14, Chinniah, K.^Aff14

المساهمون: Ghosh, Arindam, Series Editor^Aff1, Chua, Daniel, Series Editor^Aff2, de Souza, Flavio Leandro, Series Editor^Aff3, Aktas, Oral Cenk, Series Editor^Aff4, Han, Yafang, Series Editor^Aff5, Gong, Jianghong, Series Editor^Aff6, Jawaid, Mohammad, Series Editor^Aff7, Chow, Wen Shyang, editor^Aff8, Jaafar, Mariatti, editor^Aff9, Mohamad Ariff, Zulkifli, editor^Aff10, Shuib, Raa Khimi, editor^Aff11, Ahmad Zubir, Syazana, editor^Aff12

المصدر: Proceedings of the 19th Asian Workshop on Polymer Processing (AWPP 2022) : Emerging Polymer Processing Technologies for Environmental Sustainability. 24:239-249