المؤلفون: Gorecki, Krzysztof, Kowalke, Wojciech, Ptak, Przemyslaw

المصدر: 2024 25th International Microwave and Radar Conference (MIKON) Microwave and Radar Conference (MIKON), 2024 25th International. :181-184 Jul, 2024

Relation: 2024 25th International Microwave and Radar Conference (MIKON)

المؤلفون: Martinez Lahoz, J., Asiain Ansorena, D., Beltran Blazquez, J.R.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(22):27124-27136 Nov, 2023

المؤلفون: Chen, Cheng, Xie, Lu, Sun, Huhao

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Lai, Yangyang, Pan, Ke, Ha, Jonghwan, Cai, Chongyang, Yang, Junbo, Yin, Pengcheng, Xu, Jiefeng, Park, Seungbae

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Lai, Yangyang, Kataoka, Jun, Pan, Ke, Ha, Jonghwan, Yang, Junbo, Deo, Karthik A, Xu, Jiefeng, Yin, Pengcheng, Cai, Chongyang, Park, Seungbae

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2269-2274 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Lee, Jing Rou, Abdul Aziz, Mohd Sharizal^{Aff1, IDs11664023108553_cor2}, Khor, Chu Yee, Ishak, Mohammad Hafifi Hafiz, Kamarudin, Roslan, Ani, F. Che

المصدر: Journal of Electronic Materials. 53(3):1201-1213

المؤلفون: Zhang, Shuye, Ran, Duan, Xu, Sunwu, Xue, Panfei, Paik, Kyung-Wook, Wang, Chengqian, He, Peng

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :244-247 Dec, 2021

Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Lai, Y., Pan, K., Cai, C., Yin, P., Yang, J., Park, S.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):562-569 Mar, 2022

المؤلفون: xiang, Yuyan, ning, Xudong, yao, Yuan, zhan, Xiaoyan, liu, Guoling, li, Ying

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-5 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Dziurdzia, B., Gorecki, K., Ptak, P.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(11):2160-2167 Nov, 2019