المؤلفون: Nishikawa, Hiroshi, Park, Byungho, Saito, Mikiko, Mizuno, Jun

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Xie, Jiunan, Hu, Hua, Chen, Peixin, Lei, Han, Hu, Anmin, Wu, Yunwen^{Aff1, IDs1339102300462z_cor6}, Li, Ming

المصدر: Electronic Materials Letters. 20(3):326-336

المؤلفون: Guoliang Zuo, Yu Bai, Shuyan Shi, Zhanqiu Tan, Wenxue Fan, Zhiqiang Li, Hai Hao

المصدر: Journal of Materials Research and Technology, Vol 31, Iss , Pp 3332-3348 (2024)

مصطلحات موضوعية: Carbon nanotubes, Aluminum matrix composites, Surface processing marks, Solid-state bonding, Interface healing, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424016235; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/5f9c677a40ee44a6878acbbcc92f073c

المؤلفون: Wang, Yaping^{Aff14, Aff15}, Liu, Yuehan^Aff15, Jiang, Jun^Aff15

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Xu, Jinyang, Editorial Board Member^Aff9, Mocellin, Katia, editor^Aff10, Bouchard, Pierre-Olivier, editor^Aff11, Bigot, Régis, editor^Aff12, Balan, Tudor, editor^Aff13

المصدر: Proceedings of the 14th International Conference on the Technology of Plasticity - Current Trends in the Technology of Plasticity : ICTP 2023 - Volume 3. :221-228

المؤلفون: Navidirad, Mahsa^Aff14, Plumeri, John E.^Aff14, Vermaak, Natasha^Aff14, Watanabe, Masashi^Aff14, Misiolek, Wojciech Z.^Aff14

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Xu, Jinyang, Editorial Board Member^Aff9, Mocellin, Katia, editor^Aff10, Bouchard, Pierre-Olivier, editor^Aff11, Bigot, Régis, editor^Aff12, Balan, Tudor, editor^Aff13

المصدر: Proceedings of the 14th International Conference on the Technology of Plasticity - Current Trends in the Technology of Plasticity : ICTP 2023 - Volume 1. :291-298

المؤلفون: Tatsumi, Hiroaki, Kao, C.R., Nishikawa, Hiroshi

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :149-150 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Derakhshandeh, Jaber, Gerets, Carine, Inoue, Fumihiro, Capuz, Giovanni, Cherman, Vladimir, Lofrano, Melina, Hou, Lin, Cochet, Tom, De Preter, Inge, Webers, Tomas, Bex, Pieter, Jamieson, Geraldine, Maehara, Masataka, Shafahian, Ehsan, Bertheau, Julien, Beyne, Eric, La Tulipe, Douglas Charles, Beyer, Gerald, Van der Plas, Geert, Miller, Andy

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1119-1124 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Jemaa, S. Ben, Gagnon, P., Dione, A., Toure, M. Kabirou, Morissette, JF., Souare, P. Momar, Sylvestre, J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :194-200 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Xiao, J., Z., Q., Z., B., F., X.

المصدر: 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME) Electron Device and Mechanical Engineering (ICEDME), 2020 3rd International Conference on. :617-620 May, 2020

Relation: 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

المؤلفون: Safiullin, R.^{Aff1, IDS0036029523090197_cor1}

المصدر: Russian Metallurgy (Metally). 2023(9):1345-1349