المؤلفون: Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi, Matsumura, Syo

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :215-216 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Somidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye, Nogita, Kazuhiro

المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :177-178 May, 2022

Relation: 2022 International Conference on Electronics Packaging (ICEP)

المؤلفون: Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro, Nogita, Kazuhiro

المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :223-228 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

المؤلفون: Saud, Norainiza^Aff10, Mohd Salleh, Mohd Arif Anuar^Aff10, Mohd Said, Rita^Aff10, Somidin, Flora^Aff10, Mohamad Zaimi, Nur Syahirah^Aff10, Ramli, Mohd Izrul Izwan^Aff10

المساهمون: Bergmann, Carlos P., Series Editor^Aff1, Frade, Jorge R, Editorial Board Member^Aff2, Carda Castelló, Juan Bautista, Editorial Board Member^Aff3, Bolmaro, Raul, Editorial Board Member^Aff4, Esposito, Vincenzo, Editorial Board Member^Aff5, Salleh, Mohd Arif Anuar Mohd, editor^Aff6, Abdul Aziz, Mohd Sharizal, editor^Aff7, Jalar, Azman, editor^Aff8, Izwan Ramli, Mohd Izrul, editor^Aff9

المصدر: Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances. :3-24

المؤلفون: Somidin, Flora^Aff10, Said, Rita Mohd^Aff10, Saud, Norainiza^Aff10, Salleh, Mohd Arif Anuar Mohd^Aff10

المساهمون: Bergmann, Carlos P., Series Editor^Aff1, Frade, Jorge R, Editorial Board Member^Aff2, Carda Castelló, Juan Bautista, Editorial Board Member^Aff3, Bolmaro, Raul, Editorial Board Member^Aff4, Esposito, Vincenzo, Editorial Board Member^Aff5, Salleh, Mohd Arif Anuar Mohd, editor^Aff6, Abdul Aziz, Mohd Sharizal, editor^Aff7, Jalar, Azman, editor^Aff8, Izwan Ramli, Mohd Izrul, editor^Aff9

المصدر: Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances. :95-112

المؤلفون: Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro, Matsumura, Syo

المصدر: In Acta Materialia 1 February 2022 224

المؤلفون: Somidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo, Nogita, Kazuhiro

المصدر: In Materialia March 2020 9

المؤلفون: Yang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro, Matsumura, Syo

المصدر: In Scripta Materialia 1 January 2019 158:1-5

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