يعرض 1 - 10 نتائج من 126 نتيجة بحث عن '"Song, Jun-Yeob"', وقت الاستعلام: 0.87s تنقيح النتائج
  1. 1
    مؤتمر
    Development of a Next Generation Stretchable Substrate for Micro-LED Application

    المؤلفون: Park, Ah-Young, Lee, Jae Hak, Song, Jun-Yeob, Han, Seongheum, Kim, Seungman, Kang, Sumin

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :36-39 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    Hybrid Solder with silver hierarchical structure and particle for Synergistic effect in shear strength of die attach behaviour

    المؤلفون: Jeong, Hakyung, Lee, Jae Hak, Kim, Seung Man, Park, Ah-Young, Song, Jun-Yeob

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :509-512 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Low Height Wire bond Looping Technology using Wedge Bonding for the MMIC Package

    المؤلفون: Park, Ah-Young, Lee, Jae Hak, Kim, Seungman, Kang, Sumin, Han, Seongheum, Kim, Seong-Il, Song, Jun-Yeob

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :169-174 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  4. 4
    دورية أكاديمية
    Optimization of process parameters in micro-scale pneumatic aerosol jet printing for high-yield precise electrodes

    المؤلفون: Jeong, Hakyung, Lee, Jae Hak, Kim, Seungman, Han, Seongheum, Moon, Hyunkyu, Song, Jun-Yeob, Park, Ah-YoungAff1, IDs41598023475444_cor7

    المصدر: Scientific Reports. 13(1)

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  5. 5
    مؤتمر
    Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package

    المؤلفون: Park, Ah-Young, Lee, Jae Hak, Song, Jun-Yeob, Kim, Seung Man, Han, Seongheum

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :99-102 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    Study on the Embedded Flexible Hybrid Stack Package using Polymer Elastic Bump Interconnection Method

    المؤلفون: Lee, Jae Hak, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob

    المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-5 Sep, 2019

    Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  7. 7
    مؤتمر
    Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substate for Flexible Wearable Devices

    المؤلفون: Jeong, Seungtaek, Kim, Subin, Kim, Youngwoo, Park, Shinyoung, Park, Hyunwook, Kim, Joungho, Lee, Jae Hak, Song, Jun Yeob

    المصدر: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :387-390 Jun, 2019

    Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)

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  8. 8
    مؤتمر
    Face-up Interconnection Technique Using Direct Image Writing for Three-Dimensional Heterogeneous Flexible Electronics

    المؤلفون: Kim, Houngkyung, Song, Jun Yeob, Lee, Jae Hak, Kim, Seungman, Kim, Yongjin

    المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :920-923 Dec, 2018

    Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

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  9. 9
    مؤتمر
    Development of PEB Face-Down Interconnect Process for Wearable Device

    المؤلفون: Lee, Jae Hak, Lee, Chung Woo, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob

    المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-4 Sep, 2018

    Relation: 2018 7th Electronic System-Integration Technology Conference (ESTC)

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  10. 10
    مؤتمر
    Development of PEB face-down interconnection process for ultra thin flexible package

    المؤلفون: Lee, Jae Hak, Lee, Chung Woo, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob

    المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-4 Sep, 2017

    Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

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