المؤلفون: Lianhua Fan, Songhua Shi, Wong, C.P.

المصدر: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :303-310 2000

Relation: Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

المؤلفون: Carr, W.W., Sarma, D.S., Lejun Wang, Songhua Shi, Cook, F.L., Pfromm, P.H.

المصدر: IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting Industry applications Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE. 4:1963-1973 vol.4 1996

Relation: IAS '96. Conference Record of the 1996 IEEE Industry Applications Conference Thirty-First IAS Annual Meeting

المؤلفون: Songhua Shi, Daoqiang Lu, Wong, C.P.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):268-273 Oct, 1999

المؤلفون: Songhua Shi, Yamashita, T., Wong, C.P.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):274-281 Oct, 1999

المؤلفون: Songhua Shi, Wong, C.P.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):331-339 Oct, 1999

المؤلفون: Pengcheng Wang, Mingyu Zhou, Yue Zhao, Songhua Shi

المصدر: SAE Technical Paper Series.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d84b9e87d6f0e30a676893d6523a6f82
https://doi.org/10.4271/2022-01-7101

المؤلفون: Songhua Shi, Peter Tortorici, Sai Vadlamani, Prithwish Chatterjee

المصدر: 3D Microelectronic Packaging ISBN: 9789811570896

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d2593b100dadc424eec5142544ce9e8d
https://doi.org/10.1007/978-981-15-7090-2_14

المؤلفون: null Songhua Shi, null Daoqiang Lu, C.P. Wong

المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 22:268-273

مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bd9a982e0d4def13695f9b1d64ac9c35
https://doi.org/10.1109/6104.816093

المؤلفون: null Songhua Shi, T. Yamashita, C.P. Wong

المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 22:274-281

مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c080921f35a1c36226832bcdf8b3bba2
https://doi.org/10.1109/6104.816094

المؤلفون: Bernhard Wunderlich, Ze Zhang, Songhua Shi, Hanjie Hu, Haishan Bu, Erqiang Chen

المصدر: Journal of Macromolecular Science, Part B. 35:731-747

مصطلحات موضوعية: Materials science, Polymers and Plastics, Ethylene oxide, Annealing (metallurgy), technology, industry, and agriculture, Oxide, General Chemistry, Condensed Matter Physics, law.invention, chemistry.chemical_compound, chemistry, law, Polymer chemistry, Materials Chemistry, Physical chemistry, Molar mass distribution, Molecule, Electron microscope, Crystal twinning, Single crystal

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ca71cf470a0e2490f5efe989fee399c5
https://doi.org/10.1080/00222349608220405