المؤلفون: Nair Gourikutty, Sajay Bhuvanendran, Wu, Jiaqi, Lim, Teck Guan, Sandra, San, Jong, Ming Chinq, Lai Yee, Chia, Long, Lau Boon, Soon Wee Ho, David, Choong, Chong Ser, Liang, Ding, Tu, Xiaoguang, Wang, Wanjun, Tan, Chee-Keong, See, Alison, Wang, Hsiu-Che, Coccioli, Roberto, Tan, Ronson, Nagarajan, Radhakrishnan, Bhattacharya, Surya

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1398-1403 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Guan, Lim Teck, Soon Wee Ho, David, Chong, Chai Tai, Bhattacharya, Surya

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1728-1735 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Fernandez, D.M., Rao, Vempati Srinivsa, Soon Wee Ho David, Wai Hong See Toh Justin, Li Yan Siow

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :777-780 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

المؤلفون: Fernandez, D.M., Soon Wee Ho David, Wai Hong See Toh Justin, Siow, Li Yan, Rao, Vempati Srinivasa

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :17-22 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang

المصدر: Components, Packaging, and Manufacturing Technology, IEEE Transactions on; 2024, Vol. 14 Issue: 4 p537-546, 10p

المؤلفون: D.M. Fernandez, Soon Wee Ho David, Vempati Srinivsa Rao, Li Yan Siow, Wai Hong See Toh Justin

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Thermal copper pillar bump, Fabrication, Materials science, Resist, Mold, medicine, Bumping, Nanotechnology, Composite material, Photoresist, Electroplating, medicine.disease_cause, Lithography

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b69db53883ed67b4c7e4e2abed6c9572
https://doi.org/10.1109/eptc.2011.6184532

المؤلفون: Wai Hong See Toh Justin, Li Yan Siow, Vempati Srinivasa Rao, Soon Wee Ho David, D.M. Fernandez

المصدر: 2010 12th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Materials science, Through-silicon via, Silicon, chemistry.chemical_element, Dielectric, medicine.disease_cause, Copper, chemistry, Soldering, Mold, medicine, Adhesive, Composite material, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::11aaf40422fc86470420f41119e22a50
https://doi.org/10.1109/eptc.2010.5702598

المؤلفون: Wen Sheng Lee, Tai Chong Chai, Meei Ling Thew Serene, Jaesik Lee, Wai Hong See Toh Justin, Soon Wee Ho David, Li Yan Siow, Vempati Srinivasa Rao, D.M. Fernandez

المصدر: 2010 12th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Wire bonding, Materials science, Anodic bonding, Wafer bonding, Sputtering, Wafer, Adhesive, Thermocompression bonding, Dielectric, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fcc97351fab9b6ab5c9502b3c1627cfb
https://doi.org/10.1109/eptc.2010.5702705