المؤلفون: Spiegel, S., Sun, J., Zhao, J.

المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 28(4):2073-2082 Aug, 2023

المؤلفون: Shavit, R., Sabban, A., Sigalov, M., Lahman, A., Iluz, Z., Chayat, N., Spiegel, S.

المصدر: IEEE Microwave Magazine IEEE Microwave Microwave Magazine, IEEE. 19(3):129-135 May, 2018

المؤلفون: Spiegel, S., Kvatinsky, S., Schuster, M.

المصدر: IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 13(1):80-80 Jan, 2021

المؤلفون: Ruhland, J.^Aff16, Storz, T.^Aff16, Kößler, F.^Aff16, Ebel, A.^Aff16, Sawodny, J.^Aff16, Hillenbrand, J.^Aff16, Gönnheimer, P.^Aff16, Overbeck, L.^Aff16, Lanza, Gisela^Aff16, Hagen, M.^Aff23, Tübke, J.^Aff23, Gandert, J.^Aff17, Paarmann, S.^Aff17, Wetzel, T.^Aff17, Mohacsi, J.^Aff18, Altvater, A.^Aff18, Spiegel, S.^Aff18, Klemens, J.^Aff18, Scharfer, P.^Aff18, Schabel, W.^Aff18, Nowoseltschenko, K.^Aff19, Müller-Welt, P.^Aff19, Bause, K.^Aff19, Albers, A.^Aff19, Schall, D.^Aff20, Grün, T.^Aff20, Hiller, M.^Aff20, Schmidt, A.^Aff21, Weber, A.^Aff21, de Biasi, L.^Aff22, Ehrenberg, H.^Aff22, Fleischer, J.^Aff16

المساهمون: Cavas-Martínez, Francisco, Series Editor^Aff1, Chaari, Fakher, Series Editor^Aff2, di Mare, Francesca, Series Editor^Aff3, Gherardini, Francesco, Series Editor^Aff4, Haddar, Mohamed, Series Editor^Aff5, Ivanov, Vitalii, Series Editor^Aff6, Kwon, Young W., Series Editor^Aff7, Trojanowska, Justyna, Series Editor^Aff8, Andersen, Ann-Louise, editor^Aff9, Andersen, Rasmus, editor^Aff10, Brunoe, Thomas Ditlev, editor^Aff11, Larsen, Maria Stoettrup Schioenning, editor^Aff12, Nielsen, Kjeld, editor^Aff13, Napoleone, Alessia, editor^Aff14, Kjeldgaard, Stefan, editor^Aff15

المصدر: Towards Sustainable Customization: Bridging Smart Products and Manufacturing Systems : Proceedings of the 8th Changeable, Agile, Reconfigurable and Virtual Production Conference (CARV2021) and the 10th World Mass Customization & Personalization Conference (MCPC2021), Aalborg, Denmark, October/November 2021. :96-104

المؤلفون: Spiegel, S., Kvatinsky, S., Schuster, M.

المصدر: IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 12(4):111-112 Jan, 2020

المؤلفون: Spiegel, S., Kvatinsky, S., Schuster, M.

المصدر: IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 12(4):110-110 Jan, 2020

المؤلفون: Spiegel, S., Kvatinsky, S., Schuster, M.

المصدر: IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 12(4):115-115 Jan, 2020

المؤلفون: Spiegel, S., Kvatinsky, S., Schuster, M.

المصدر: IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 12(3):50-50 Jan, 2020

المؤلفون: Melamed, Y., Spiegel, S. J.

المصدر: 2011 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2011) Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2011 IEEE International Conference on. :1-4 Nov, 2011

Relation: 2011 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS)

المؤلفون: Spiegel, S., Thiel, A., Nussbaumer, S., Kovacs, I., Durler, M.

المصدر: IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 Radio frequency integrated circuits Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE. :563-566 2003

Relation: IEEE Radio Frequency Integrated Circuits Symposium (RFIC)