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1دورية أكاديمية
المؤلفون: Pooja Batra, Spyridon Skordas, Douglas LaTulipe, Kevin Winstel, Chandrasekharan Kothandaraman, Ben Himmel, Gary Maier, Bishan He, Deepal Wehella Gamage, John Golz, Wei Lin, Tuan Vo, Deepika Priyadarshini, Alex Hubbard, Kristian Cauffman, Brown Peethala, John Barth, Toshiaki Kirihata, Troy Graves-Abe, Norman Robson, Subramanian Iyer
المصدر: Journal of Low Power Electronics and Applications, Vol 4, Iss 2, Pp 77-89 (2014)
مصطلحات موضوعية: EDRAM, 3D, SOI, through-silicon-via (TSV), wafer stacking, Applications of electric power, TK4001-4102
وصف الملف: electronic resource
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المؤلفون: Spyridon Skordas
المصدر: Novel Patterning Technologies 2023.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e6dd8c4877fd42499467fec9ac91aa57
https://doi.org/10.1117/12.2659730 -
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المؤلفون: Katsuyuki Sakuma, Roy Yu, Michael Belyansky, Marc A Bergendahl, Juan-Manuel Gomez, Spyridon Skordas, John Knickerbocker, Dale McHerron, Ming Li, Yiu Ming Cheung, Siu Cheung So, So Ying Kwok, Chun Ho Fan, Siu Wing Lau
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0e9e73ef0437c5b113c48d69bc41d39f
https://doi.org/10.1109/ectc51906.2022.00058 -
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المؤلفون: Aakrati Jain, Kamal Sikka, Shidong Li, Juan-Manuel Gomez, Marc Bergendahl, Spyridon Skordas, Jeroen Van Borkulo, Roman Doll, Kees Biesheuvel, Mark Mueller
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fd260302a7d41c11d746bb9553da462c
https://doi.org/10.1109/ectc51906.2022.00012 -
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المؤلفون: Yiu Ming Cheung, Juan-Manuel Gomez, Chun Ho Fan, Siu Wing Lau, Siu Cheung So, D. McHerron, Michael P. Belyansky, Marc Phaneuf, Isabel de Sousa, Katsuyuki Sakuma, Spyridon Skordas, Dishit P. Parekh, So Ying Kwok, Ming Li, Martin M Desrochers
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Silicon, business.industry, Diamond blade, chemistry.chemical_element, Direct bonding, Die (integrated circuit), chemistry, Plasma-enhanced chemical vapor deposition, Chemical-mechanical planarization, Optoelectronics, Wafer, Wafer dicing, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dba5ed58982130cfce46c492c6fbd1c8
https://doi.org/10.1109/ectc32696.2021.00075 -
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المؤلفون: Yohann Spiegel, Oleg Gluschenkov, Hemanth Jagannathan, Spyridon Skordas, Frank Torregrosa, Vinay Pai, A. Filip Petrescu, Mona A. Ebrish, Benjamin Roux
المصدر: 2018 22nd International Conference on Ion Implantation Technology (IIT).
مصطلحات موضوعية: Materials science, Dopant, business.industry, Doping, 0211 other engineering and technologies, 020101 civil engineering, Tapering, 02 engineering and technology, Plasma-immersion ion implantation, 0201 civil engineering, Ion implantation, 021105 building & construction, Trench, Optoelectronics, Wafer, business, Scaling
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6bca37d2136226b8b79d16fc5ed9bbe0
https://doi.org/10.1109/iit.2018.8807952 -
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المصدر: 3D Integration in VLSI Circuits ISBN: 9781315200699
مصطلحات موضوعية: chemistry.chemical_compound, Three dimensional integration, Materials science, chemistry, business.industry, Oxide, Stacking, Optoelectronics, Wafer, business, High volume manufacturing
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4189ce7ac52acedcfd9d2673410c44c9
https://doi.org/10.1201/9781315200699-6 -
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المؤلفون: Balasubramanian S. Haran, Kisup Chung, Spyridon Skordas, Stan D. Tsai, Mark L. Lenhardt, Su Chen Fan, Sean Teehan, Alex Joseph Varghese, Ruilong Xie, Pietro Montanini
المصدر: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Materials science, Yield (engineering), Gas cluster ion beam, business.industry, Logic gate, Chemical-mechanical planarization, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Node (circuits), Wafer, Nitride, business, Metrology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8fbd27d6ee98fb8fd9dfb24709c5f9b4
https://doi.org/10.1109/asmc.2018.8373209 -
9Particle reduction in back end of line plasma-etching process: CFM: Contamination free manufacturing
المؤلفون: Lijuan Zou, Jeffrey C. Shearer, Spyridon Skordas, Alex Vaghese, Vinay Pai
المصدر: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: 0209 industrial biotechnology, Back end of line, 020901 industrial engineering & automation, Plasma etching, Materials science, Etching (microfabrication), Semiconductor device fabrication, Nuclear engineering, Process (computing), Particle, 02 engineering and technology, Plasma, Contamination
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::51c9a137fa96f967b6c7e1593b2272d0
https://doi.org/10.1109/asmc.2018.8373167 -
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المؤلفون: Nelson Felix, Spyridon Skordas, Rohit Galatage, Junli Wang, Dinesh Gupta, Xin Miao, Deok-Hyung Lee, R. Divakaruni, John C. Arnold, Vamsi Paruchuri, Ohyun Kwon, Adra Carr, Seng Luan Lee, Soon-Cheon Seo, T. Gow, James Chingwei Li, Muthumanickam Sankarapandian, Y. Xu, Zuoguang Liu, D. Corliss, Stuart A. Sieg, Robert C. Wong, Chun Wing Yeung, Albert M. Young, Jingyun Zhang, Jeffrey C. Shearer, Huiming Bu, C. Labelle, Zhenxing Bi, Bassem Hamieh, M. Guillom, Andreas Knorr, Tenko Yamashita, Jae-Yoon Yoo, D. Brown, Peng Xu, Robin Chao, Dexin Kong, Terence B. Hook, P. Oldiges, T. Wu, Shogo Mochizuki, Young-Kwan Park, W. Xu, Raja Muthinti, S. Lian, Ruqiang Bao, S. Kanakasabapathy, Myung-Hee Na, Richard A. Conti, Frougier Julien, Robert R. Robison, Nicolas Loubet, Yann Mignot, Theodorus E. Standaert, Hemanth Jagannathan, Ho Ju Song, Pietro Montanini, Myounggon Kang, John G. Gaudiello, Mukesh Khare, Abraham Arceo, Su Chen Fan, Andrew M. Greene
المصدر: 2017 Symposium on VLSI Technology.
مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Extreme ultraviolet lithography, Transistor, Nanotechnology, 02 engineering and technology, 021001 nanoscience & nanotechnology, Electrostatics, 01 natural sciences, law.invention, law, Logic gate, 0103 physical sciences, Stiction, Optoelectronics, Work function, 0210 nano-technology, business, Nanosheet, Leakage (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8172c77d8489643bbaac20dc37532850
https://doi.org/10.23919/vlsit.2017.7998183