المؤلفون: Herberger, Callan^{Aff1, IDs40964024005726_cor1}, Heinrich, Lauren, LaNeave, Erik, Post, Brian, Fillingim, Kenton B., MacDonald, Eric^{Aff1, Aff2}, Feldhausen, Thomas, Haley, James

المصدر: Progress in Additive Manufacturing. :1-13

المؤلفون: Conseil-Gudla, H., Li, F., Ambat, R.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 21(4):594-602 Dec, 2021

المؤلفون: Kumar, B. Senthil, Danila, Bayaras Abito, Joanne, Chong Mei Hoe, Fen, Zhang Rui, Rath, Santosh Kumar, Li-San, Chan, Jason, Wong Chin Yeung

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :733-737 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ab Aziz bin Mohd Yusof, Mohd Al Fatihhi Mohd Szali Januddi, Muhamad Noor Harun

المصدر: Ain Shams Engineering Journal, Vol 13, Iss 6, Pp 101769- (2022)

مصطلحات موضوعية: Solder bump, Surface tension, Solder density, Standoff height, Maximum width, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2090447922000806; https://doaj.org/toc/2090-4479

URL الوصول: https://doaj.org/article/fc6837a6de3d43548e8d2f9ac14abf3e

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المؤلفون: Clech, J-P M., Augis, J. A.

المساهمون: Lau, John H., editor

المصدر: Solder Joint Reliability : Theory and Applications. :588-613

المؤلفون: Rajan Ambat, Helene Conseil-Gudla, Feng Li

المصدر: Conseil-Gudla, H, Li, F & Ambat, R 2021, ' Reflow Residues on Printed Circuit Board Assemblies and Interaction with Humidity ', IEEE Transactions on Device and Materials Reliability, vol. 21, no. 4, pp. 594-602 . https://doi.org/10.1109/TDMR.2021.3120941

مصطلحات موضوعية: Conductivity, Absorption of water, Materials science, Humidity, food and beverages, Reflow, Trapped residues, Electronic, Optical and Magnetic Materials, Printed circuit board, Standoff height, Water absorption, Board, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Components

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e02985371a1c95435d8c86628a9f535d
https://orbit.dtu.dk/en/publications/cc32000e-b31b-4117-bf26-db71813f793d

المؤلفون: Li, X. P., Xia, J. M., Zhou, M. B., Ma, X., Zhang, X. P.

المصدر: Journal of Electronic Materials. December 2011 40(12):2425-2435

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المؤلفون: Prasad, Ray P.^Aff2

المساهمون: Prasad, Ray P.^Aff1

المصدر: Surface Mount Technology : Principles and Practice. :471-513