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1دورية أكاديمية
المؤلفون: Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
المصدر: Journal of Materials Research and Technology, Vol 19, Iss , Pp 2510-2515 (2022)
مصطلحات موضوعية: Electronic materials, Assembly technology, Transient liquid phase reaction, Interfaces, In–Sn Intermetallics, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2كتاب
المؤلفون: Joaquin Quiñonero-Candela, Masashi Sugiyama, Anton Schwaighofer, Neil D. Lawrence, Amos Storkey, David Corfield, Matthias Hein, Lars Kai Hansen, Shai Ben-David, Takafumi Kanamori, Hidetoshi Shimodaira, Masashi Sugiyama, Neil Rubens, Klaus-Robert Müller, Arthur Gretton, Alexander J. Smola, Jiayuan Huang, Marcel Schmittfull, Karsten Borgwardt, Bernhard Schölkopf, Steffen Bickel, Michael Brückner, Tobias Scheffer, Amir Globerson, Choon Hui Teo, Sam Roweis
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المؤلفون: Steffen Bickel, Iuliana Panchenko, M. Jurgen Wolf
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aacd8da6f67908fa77cf50936fab4bfa
https://doi.org/10.1109/estc55720.2022.9939411 -
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المؤلفون: Adil Shehzad, Ran Yin, Iuliana Panchenko, Maik Muller, Steffen Bickel, Olav Birlem, Sebastian Quednau, Jurgen M. Wolf
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::46dd4902233cf71de31633ac57c3b52a
https://doi.org/10.1109/estc55720.2022.9939420 -
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المؤلفون: Wataru Tachikawa, Steffen Bickel, M. Jurgen Wolf, Iuliana Panchenko
المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: 010302 applied physics, Work (thermodynamics), Interconnection, business.product_category, Materials science, 020208 electrical & electronic engineering, Intermetallic, Solid-state, Fine pitch, 02 engineering and technology, 01 natural sciences, Phase formation, Shear (sheet metal), 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Die (manufacturing), Composite material, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::57885cd49a66a4dbaf0f124eab6c569d
https://doi.org/10.1109/estc48849.2020.9229826 -
6Manufacturing and Reliability Issues of Highly Integrated Packages for Power Electronic Applications
المؤلفون: Karsten Meier, Mike Roellig, Steffen Bickel, Karlheinz Bock
المصدر: 2019 42nd International Spring Seminar on Electronics Technology (ISSE).
مصطلحات موضوعية: Reliability (semiconductor), Materials science, Interface (computing), visual_art, Thermography, Thermal, Electronic component, visual_art.visual_art_medium, Ampacity, Thermal management of electronic devices and systems, Automotive engineering, Power (physics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6f01191d2bf8f98b4585aee633b464d4
https://doi.org/10.1109/isse.2019.8810305 -
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المؤلفون: Jörg Meyer, Shawon Sen, Iuliana Panchenko, M. Jurgen Wolf, Steffen Bickel
المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Bonding process, Interconnection, Quality (physics), Materials science, Reliability (semiconductor), Pressure sensitive, Intermetallic, Electronic packaging, Fine pitch, Engineering physics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::19f01b3b2f58bb5868664203ddee9007
https://doi.org/10.1109/estc.2018.8546413 -
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المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Nanostructure, Materials science, Silicon, chemistry, Nanoporous, Electronic packaging, Intermetallic, chemistry.chemical_element, Lamellar structure, Composite material, Porosity, Dissolution
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2bc70270fc7f631e187fd42a6150236c
https://doi.org/10.1109/estc.2018.8546349 -
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المؤلفون: Steffen Bickel, Robert Hoehne, Iuliana Panchenko, Joerg Meyer, M. Juergen Wolf
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Shearing (physics), Interconnection, Materials science, Scanning electron microscope, 020502 materials, Fine pitch, 02 engineering and technology, 01 natural sciences, 0205 materials engineering, Shear (geology), 0103 physical sciences, Temperature sensitive, Composite material, Eutectic system
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9cd5b83e5842189ad1633f1daf6da6ca
https://doi.org/10.1109/ectc.2018.00125 -
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المؤلفون: Cordula Guder, Sebastian Brarda, Anoop R Katti, Jean Baptiste Faddoul, Christian Reisswig, Steffen Bickel, Johannes Höhne
المصدر: EMNLP
مصطلحات موضوعية: FOS: Computer and information sciences, Computer Science - Machine Learning, Computer Science - Computation and Language, Information retrieval, Computer science, Computer Vision and Pattern Recognition (cs.CV), Computer Science - Computer Vision and Pattern Recognition, Computer Science - Neural and Evolutionary Computing, 02 engineering and technology, 010501 environmental sciences, computer.software_genre, 01 natural sciences, Pipeline (software), Machine Learning (cs.LG), Task (project management), Information extraction, 020204 information systems, ComputingMethodologies_DOCUMENTANDTEXTPROCESSING, 0202 electrical engineering, electronic engineering, information engineering, Segmentation, Neural and Evolutionary Computing (cs.NE), Representation (mathematics), Computation and Language (cs.CL), computer, 0105 earth and related environmental sciences
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4fc756476f94e498014f58d9bba56d08
https://doi.org/10.18653/v1/d18-1476