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1دورية أكاديمية
المؤلفون: William, J. Murphy, Tom, C. Lee, Chapple-Sokol, Jonathan, Daniel, A. Delibac, He, Z. X., Stephen, E. Luce, Stephen, A. Mongeon, David, C. Thomas, Daniel, S. Vanslette, Timothy, D. Sullivan
المصدر: MRS Online Proceedings Library. 1079(1)
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المؤلفون: Micheal Leach, William J. Cote, Stephen E. Luce, Carter Welling Kaanta, William R. Hill, Howard S. Landis, Charles W. Koburger, Cheryl A. Hoffman, Walter Frederick Lange, Peter J Burke
المصدر: Thin Solid Films. 220:1-7
مصطلحات موضوعية: Materials science, business.industry, Semiconductor device fabrication, Metals and Alloys, Logic family, Polishing, Nanotechnology, Surfaces and Interfaces, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, CMOS, Chemical-mechanical planarization, Hardware_INTEGRATEDCIRCUITS, Materials Chemistry, Wafer, Dry etching, Process engineering, business, Dram
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المؤلفون: B. Porth, Philippe M. Vereecken, Thomas J. Mcdevitt, C. Johnson, Jennifer C. Robbins, T. Rutkowski, M. Wenner, J. Gambino, Erick G. Walton, Stephen E. Luce, Kenneth Lawrence Devries, D. Rath, Jonathan D. Chapple-Sokol
المصدر: 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
مصطلحات موضوعية: Materials science, fungi, Metallurgy, technology, industry, and agriculture, Copper interconnect, chemistry.chemical_element, macromolecular substances, Copper, Cathode, Corrosion, law.invention, Anode, stomatognathic system, chemistry, law, Etching (microfabrication), Dry etching, Reactive-ion etching
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1e412f1a769f28f4127f9d445a5c9407
https://doi.org/10.1109/ipfa.2008.4588209 -
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المؤلفون: V. McGahay, B. Porth, T. Pricer, H. Wildman, C. Benson, C. Senowitz, M. Gibson, A. Piper, Edward C. Cooney, T. Standaert, R. Kontra, A.K. Stamper, Stephen E. Luce, J. Gambino, P. Biolsi, Tom McDevitt
المصدر: Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614).
مصطلحات موضوعية: Permittivity, chemistry.chemical_classification, Yield (engineering), Materials science, business.industry, Polishing, chemistry.chemical_element, Dielectric, Polymer, Fluorosilicate glass, Copper, chemistry, Chemical-mechanical planarization, Electronic engineering, Optoelectronics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ece057db322ab70398de5c1dfa6b4660
https://doi.org/10.1109/ipfa.2002.1025628 -
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المؤلفون: V. Samek, T. Kane, T. Stamper, B. Reuter, Stephen E. Luce, P. McLaughlin, Jeff Gambino, M. Dunbar, H. Trombley, C. Weinstein, F. Allen
المصدر: MRS Proceedings. 766
مصطلحات موضوعية: Yield (engineering), Materials science, business.industry, Copper interconnect, chemistry.chemical_element, Interconnect technology, Fluorosilicate glass, Copper, Reliability (semiconductor), chemistry, Trench, Optoelectronics, Process window, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f89b59e6334672cd4898b7de61da41cc
https://doi.org/10.1557/proc-766-e5.5 -
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المؤلفون: A.K. Stamper, T. Katsetos, P. C. Andricacos, John E. Heidenreich, Stephen E. Luce, John Owen Dukovic, Ronald D. Goldblatt, Naftali E. Lustig, Richard A. Wachnik, J. Slattery, Daniel C. Edelstein, A. Simon, Thomas L. McDevitt, H. S. Rathore, Cyprian E. Uzoh, William J. Cote, P. McLaughlin
المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).
مصطلحات موضوعية: Functional verification, Materials science, business.industry, Electrical engineering, Copper interconnect, Ranging, Hardware_PERFORMANCEANDRELIABILITY, Stress testing (software), law.invention, Microprocessor, Reliability (semiconductor), CMOS, law, Hardware_INTEGRATEDCIRCUITS, Static random-access memory, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::847939bd04f73a3e4baee4d7e4937c68
https://doi.org/10.1109/iitc.1998.704776 -
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المؤلفون: L. Su, Naftali E. Lustig, John E. Heidenreich, Cyprian E. Uzoh, Peter Roper, Stephen E. Luce, R. Schulz, Richard A. Wachnik, William J. Cote, A. Simon, Ronald D. Goldblatt, J. Dukovic, W. Motsiff, J. Slattery, Daniel C. Edelstein, H. Rathore, Thomas L. McDevitt
المصدر: International Electron Devices Meeting. IEDM Technical Digest.
مصطلحات موضوعية: Engineering, business.industry, Copper-wiring, Copper interconnect, Electrical engineering, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Copper, Reliability (semiconductor), chemistry, CMOS, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Static random-access memory, business, Current density, Scaling
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::562fb72b2e9b5262a16ac9dec8cab0e7
https://doi.org/10.1109/iedm.1997.650496 -
8مؤتمر
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