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1دورية أكاديمية
المؤلفون: Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow
المصدر: Micromachines, Vol 10, Iss 5, p 342 (2019)
مصطلحات موضوعية: fan-out wafer level packaging, panel level packaging, heterogeneous integration, Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
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المؤلفون: Tanja Braun, Ole Hölck, Marcus Voitel, Mattis Obst, Steve Voges, Karl-Friedrich Becker, Rolf Aschenbrenner, Martin Schneider-Ramelow
المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9044fe94b97659d42ff8fb6659e49d2d
https://doi.org/10.1109/edtm55494.2023.10102969 -
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المؤلفون: Tanja Braun, Ole Holck, Mattis Obst, Steve Voges, Ruben Kahle, Lars Bottcher, Mathilde Billaud, Lutz Stobbe, Karl-Friedrich Becker, Rolf Aschenbrenner, Marcus Voitel, Friedrich-Leonhard Schein, Lutz Gerholt, Martin Schneider-Ramelow
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::887a6880363d374ec8b9f1a684099501
https://doi.org/10.1109/ectc51906.2022.00133 -
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المؤلفون: Tina Thomas, M. Schmied, P. Fruehauf, R. Fust, D. Schütze, Martin Schneider-Ramelow, Tanja Braun, M. Kreitmair, Steve Voges, W. Neifer, M. Heimann, S. Nerreter, K.-F. Becker, S. Gottwald, B. Schröder, A. Hofmeister, K-D. Lang, R. Blank
المصدر: International Symposium on Microelectronics. 2019:000415-000422
مصطلحات موضوعية: Flexibility (engineering), Industry 4.0, Computer science, Automotive Engineering, Resource efficiency, Production (economics), Wireless sensor network, Smart manufacturing, Manufacturing engineering, Efficient energy use
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c057bc78b58cd5a0c2b096c785773e4e
https://doi.org/10.4071/2380-4505-2019.1.000415 -
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المؤلفون: Markus Wohrmann, Steve Voges, Tanja Braun, Robert Gernhardt, John P. Massey, Kevin Edwards, Matthew Koch, Michelle Fowler
المصدر: International Symposium on Microelectronics. 2018:000051-000056
مصطلحات موضوعية: 010302 applied physics, Laser ablation, Materials science, business.industry, 020208 electrical & electronic engineering, Fan-out, 02 engineering and technology, Epoxy, medicine.disease_cause, 01 natural sciences, System in package, visual_art, Mold, 0103 physical sciences, Automotive Engineering, 0202 electrical engineering, electronic engineering, information engineering, visual_art.visual_art_medium, medicine, Optoelectronics, Redistribution (chemistry), Wafer, business, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::74330f320f8aa0f17073914e3f8fe951
https://doi.org/10.4071/2380-4505-2018.1.000051 -
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المؤلفون: Steve Voges, Martin Schneider-Ramelow, Tanja Braun, Robert Gernhardt, Damian Freimund, Dirk Schwantuschke, Sven Engels, Thanh Duy Nguyen, Karl-Friedrich Becker, Markus Wohrmann, Michael Pretl, Klaus-Dieter Lang, Ivan Ndip, Erdin Ture
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Wire bonding, business.product_category, Materials science, business.industry, 020208 electrical & electronic engineering, Compression molding, 020206 networking & telecommunications, 02 engineering and technology, Electrical connection, visual_art, Electronic component, 0202 electrical engineering, electronic engineering, information engineering, visual_art.visual_art_medium, Optoelectronics, Die (manufacturing), Junction temperature, Redistribution layer, business, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::38dbdcd6512fad7a4d2aea2045901687
https://doi.org/10.1109/ectc32862.2020.00014 -
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المؤلفون: Lutz Stobbe, K.-F. Becker, Martin Schneider-Ramelow, K-D. Lang, Lars Boettcher, Ole Hoelck, M. Voitel, Tanja Braun, Steve Voges, Michael Topper, Rolf Aschenbrenner
المصدر: 2019 IEEE CPMT Symposium Japan (ICSJ).
مصطلحات موضوعية: Flexibility (engineering), business.product_category, Computer science, business.industry, Chip, Manufacturing engineering, law.invention, law, Component (UML), Key (cryptography), Miniaturization, System integration, Die (manufacturing), business, Manifold (fluid mechanics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5867a6d0121cd950d3f7c9fbf2bb3574
https://doi.org/10.1109/icsj47124.2019.8998753 -
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المؤلفون: Tanja Braun, Steve Voges, K.-F. Becker, Martin Schneider-Ramelow, R. Kahle, K-D. Lang, O. Holck, Marc Dreissigacker, J. Bauer, Rolf Aschenbrenner
المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Wafer-scale integration, Packaging engineering, business.industry, Computer science, Automotive engineering, law.invention, Capacitor, Material selection, law, System integration, Power Management Unit, business, Wireless sensor network, Energy harvesting
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d507048d2bdcb3012702fbab56321ec8
https://doi.org/10.23919/iwlpc.2019.8914021 -
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المؤلفون: Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Pascal Graap, Markus Wohrmann, R. Aschenbrenner, Marc Dreissigacker, Martin Schneider-Ramelow, Klaus-Dieter Lang
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Microelectromechanical systems, Computer science, business.industry, Capacitive sensing, Electrical engineering, System integration, Microelectronics, Ultrasonic sensor, Image sensor, business, Wafer-level packaging, Pressure sensor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::34d15bba78ae28f4f1792a707200d324
https://doi.org/10.1109/ectc.2019.00135 -
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المؤلفون: John P. Massey, Robert Gernhardt, Markus Wohrmann, Michelle Fowler, Tanja Braun, Steve Voges
مصطلحات موضوعية: chemistry.chemical_classification, Chemical process, Materials science, Thermoplastic, Wafer bonding, Epoxy, Thermal expansion, Embedded Wafer Level Ball Grid Array, chemistry, visual_art, Interposer, visual_art.visual_art_medium, Wafer, Composite material
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3532bd85a5b4ad4ab79623dae9603dfd