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1دورية أكاديمية
المؤلفون: Sporer, M., Vasilas, I., Adzemovic, A., Graber, N., Reich, S., Gueli, C., Eickenscheidt, M., Diester, I., Stieglitz, T., Ortmanns, M.
المصدر: IEEE Transactions on Biomedical Circuits and Systems IEEE Trans. Biomed. Circuits Syst. Biomedical Circuits and Systems, IEEE Transactions on. 18(2):247-262 Apr, 2024
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2مؤتمر
المؤلفون: Schulte, J., Hofert, M. M., Vasilas, I. G., Stieglitz, T.
المصدر: 2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) Engineering in Medicine & Biology Society (EMBC), 2022 44th Annual International Conference of the IEEE. :4139-4142 Jul, 2022
Relation: 2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
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3دورية أكاديمية
المؤلفون: Goncalves Seabra, A.C., Silva, A.F.d., Stieglitz, T., Amado-Rey, A.B.
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(23):23486-23493 Dec, 2022
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4مؤتمر
المؤلفون: Baslan, Y., Stieglitz, T., Kiele, P.
المصدر: 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) Engineering in Medicine & Biology Society (EMBC), 2021 43rd Annual International Conference of the IEEE. :6433-6436 Nov, 2021
Relation: 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
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5مؤتمر
المؤلفون: Bielefeldt, S., Stieglitz, T., Eickenscheidt, M.
المصدر: 2021 10th International IEEE/EMBS Conference on Neural Engineering (NER) Neural Engineering (NER), 2021 10th International IEEE/EMBS Conference on. :601-604 May, 2021
Relation: 2021 10th International IEEE/EMBS Conference on Neural Engineering (NER)
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6دورية أكاديمية
المؤلفون: Langenmair, M., Hofert, M., Eickenscheidt, M., Stieglitz, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(12):2046-2054 Dec, 2021
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7دورية أكاديمية
المؤلفون: Amado-Rey, A.B., Seabra, A.C.G., Becker, F.J., Fournelle, M., Stieglitz, T.
المصدر: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 5(8):1-4 Aug, 2021
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8مؤتمر
المؤلفون: Pasluosta, C., Lauck, T. B., Krauskopf, T., Klein, L., Mueller, M., Herget, G. W., Stieglitz, T.
المصدر: 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) Engineering in Medicine & Biology Society (EMBC), 2020 42nd Annual International Conference of the IEEE. :3815-3818 Jul, 2020
Relation: 2020 42nd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society
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9دورية أكاديمية
المؤلفون: Kiele, P., Cvancara, P., Langenmair, M., Mueller, M., Stieglitz, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(11):1803-1813 Nov, 2020
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10مؤتمر
المؤلفون: Pfau, J., Ganatra, D., Weltin, A., Urban, G., Kieninger, J., Stieglitz, T.
المصدر: 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) Engineering in Medicine and Biology Society (EMBC), 2019 41st Annual International Conference of the IEEE. :3762-3765 Jul, 2019
Relation: 2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
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