المؤلفون: Huo, Y., Sofronici, S., Wang, X., D'Agati, M.J., Finkel, P., Bussmann, K., Mion, T., Staruch, M., Jones, N.J., Wheeler, B., McLaughlin, K.L., Allen, M.G., Olsson, R.H.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(13):14025-14040 Jul, 2023

المؤلفون: Sanghvi, Rohan, Kuo, Justin, Ravi, Adarsh, La, Amit

المصدر: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2023 IEEE 36th International Conference on. :9-12 Jan, 2023

Relation: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: D'Agati, M.J., Sofronici, S., Huo, Y., Finkel, P., Bussmann, K., McLaughlin, K.L., Wheeler, B., Jones, N.J., Mion, T., Staruch, M., Olsson, R.H.

المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 32(1):91-102 Feb, 2023

المؤلفون: Huo, Y., Sofronici, S., D'Agati, M.J., Olsson, R.H.

المصدر: IEEE Open Journal of the Solid-State Circuits Society IEEE Open J. Solid-State Circuits Soc. Solid-State Circuits Society, IEEE Open Journal of the. 3:214-222 2023

المؤلفون: Long, Yuxiong, Huang, Jun Z., Wei, Zhongming, Luo, Jun-Wei, Jiang, Xiangwei

المصدر: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2019 International Conference on. :1-4 Sep, 2019

Relation: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Long, Y., Huang, J.Z., Huang, Q., Xu, N., Jiang, X., Niu, Z., Huang, R., Li, S.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 41(6):948-951 Jun, 2020

المؤلفون: Long, Y., Huang, J.Z., Huang, Q., Xu, N., Jiang, X., Niu, Z., Esseni, D., Huang, R., Li, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 66(11):4982-4988 Nov, 2019

المؤلفون: Naik, Yashasvi^{Aff1, IDs10751024019297_cor1}, Mehta, Disha, Desai, Riddhi, Parmar, P. R., Thakor, P. B.

المصدر: Interactions. 245(1)

المؤلفون: Yujia Huo, Sydney Sofronici, Michael J. D'Agati, Roy H. Olsson

المصدر: IEEE Open Journal of the Solid-State Circuits Society, Vol 3, Pp 214-222 (2023)

مصطلحات موضوعية: readout, multiferroic sensor, noise canceling, strain modulation, transimpedance amplifier, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10272978/; https://doaj.org/toc/2644-1349

URL الوصول: https://doaj.org/article/33900ae8633844c8bc7fe3c49b462c81

المؤلفون: Xiaolin Zeng, Jing Wu, Shenbo Zhu, Yu Liu, Yang Zhang, Yuan Li, Yonghai Chen

المصدر: New Journal of Physics, Vol 26, Iss 1, p 013023 (2024)

مصطلحات موضوعية: strain-modulation, spin splitting, anomalous circular photogalvanic effect, Science, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1367-2630

URL الوصول: https://doaj.org/article/259d767f167e4e1f9b83fcd6638b5251