المؤلفون: Chih-Ju Chan, Feng-Mao Hsu, Su, Yen-Fu, Chiang, Kuo-Ning

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :62-65 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Hsu, Feng-Mao, Su, Yen-Fu, Chiang, Kuo-Ning

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :691-694 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Yang, Che-Chia, Tsai, Chia-Chi, Su, Yen-Fu, Chiang, Kuo-Ning

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :787-790 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Chiang, Yi-Che, Hsu, Feng-Mao, Su, Yen-Fu, Chiang, Kuo-Ning

المصدر: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International. :335-338 Oct, 2014

Relation: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Yu-Hsiang Yang, Su, Yen-Fu, Chiang, Kuo-Ning

المصدر: Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :178-181 May, 2014

Relation: 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Su, Yen-Fu, Lin, Chun-Te, Kuo, Tzu-Ying, Chiang, Kuo-Ning

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-4 Apr, 2014

Relation: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Lin, Kuan-Chung, Tsai, Chia-Chi, Su, Yen-Fu, Hung, Tuan-Yu, Chiang, Kuo-Ning

المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :105-108 Oct, 2013

Relation: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Su, Yen-Fu, Lin, Chun-Te, Kuo, Tzu-Ying, Chiang, Kuo-Ning

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1834-1839 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Su, Yen-Fu, Yang, Yu-Hsiang, Yang, Wen-Kun, Chiang, Kuo-Ning

المصدر: 2012 14th International Conference on Electronic Materials and Packaging (EMAP) Electronic Materials and Packaging (EMAP), 2012 14th International Conference on. :1-5 Dec, 2012

Relation: 2012 14th International Conference on Electronic Materials and Packaging (EMAP)

المؤلفون: Chen, Pei-Chi, Su, Yen-Fu, Yang, Shin-Yueh, Chiang, Kuo-Ning

المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :83-86 Oct, 2011

Relation: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)