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المؤلفون: Klod Kokini, Sudarshan Rangaraj
المصدر: Materials Science Forum. :379-384
مصطلحات موضوعية: Thermal shock, Materials science, Mechanical Engineering, Thermal resistance, Alloy, engineering.material, Condensed Matter Physics, Thermal barrier coating, Coating, Mechanics of Materials, engineering, Fracture (geology), General Materials Science, Cubic zirconia, Composite material, Yttria-stabilized zirconia
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9e318c4ae0ea3fdcd718f67ecfa6f671
https://doi.org/10.4028/www.scientific.net/msf.492-493.379 -
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المؤلفون: Sudarshan Rangaraj, Kristopher Frutschy, Rajen Dias
المصدر: IEEE Transactions on Device and Materials Reliability. 4:153-162
مصطلحات موضوعية: Interconnection, Materials science, Metallurgy, Thermal expansion, Die (integrated circuit), Electronic, Optical and Magnetic Materials, Stress (mechanics), Printed circuit board, Residual stress, Soldering, Integrated circuit packaging, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality
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3
المؤلفون: Klod Kokini, Sudarshan Rangaraj
المصدر: Materials Science and Engineering: A. 366:356-366
مصطلحات موضوعية: Materials science, Viscoplasticity, Mechanical Engineering, Composite number, Condensed Matter Physics, Aspect ratio (image), Creep, Mechanics of Materials, visual_art, visual_art.visual_art_medium, Particle, General Materials Science, Cubic zirconia, Ceramic, Deformation (engineering), Composite material
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4
المؤلفون: Sudarshan Rangaraj, Klod Kokini
المصدر: Acta Materialia. 52:455-465
مصطلحات موضوعية: Thermal shock, Materials science, Polymers and Plastics, Thermal resistance, Alloy, Metals and Alloys, Micromechanics, engineering.material, Electronic, Optical and Magnetic Materials, Thermal barrier coating, Fracture toughness, Ceramics and Composites, engineering, Cubic zirconia, Composite material, Yttria-stabilized zirconia
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المؤلفون: Klod Kokini, Sudarshan Rangaraj
المصدر: Journal of Engineering Materials and Technology. 126:103-115
مصطلحات موضوعية: Thermal shock, Materials science, Yield (engineering), Mechanical Engineering, Fracture mechanics, Condensed Matter Physics, Thermal barrier coating, Cohesive zone model, Fracture toughness, Mechanics of Materials, General Materials Science, Composite material, Material properties, Yttria-stabilized zirconia
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::35013bfe7a24e9586e45b3937199ed28
https://doi.org/10.1115/1.1631028 -
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المؤلفون: Klod Kokini, Sudarshan Rangaraj
المصدر: Surface and Coatings Technology. 173:201-212
مصطلحات موضوعية: Thermal shock, Materials science, Fracture mechanics, Surfaces and Interfaces, General Chemistry, engineering.material, Condensed Matter Physics, Surfaces, Coatings and Films, Thermal barrier coating, Coating, Flexural strength, Materials Chemistry, engineering, Fracture (geology), Cubic zirconia, Composite material, Yttria-stabilized zirconia
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7
المؤلفون: Jeffery DeJonge, Sudarshan Rangaraj, B Beardsley, Klod Kokini
المصدر: Surface and Coatings Technology. 154:223-231
مصطلحات موضوعية: Thermal shock, Materials science, Thermal resistance, Surfaces and Interfaces, General Chemistry, engineering.material, Condensed Matter Physics, Surfaces, Coatings and Films, Thermal barrier coating, Cracking, Coating, Thermal, Materials Chemistry, engineering, Gradation, Composite material, Yttria-stabilized zirconia
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8
المؤلفون: Klod Kokini, Sudarshan Rangaraj
المصدر: Mechanics of Time-Dependent Materials. 6:171-191
مصطلحات موضوعية: Thermal shock, Materials science, Mechanical Engineering, General Chemical Engineering, Aerospace Engineering, Microstructure, Ceramic matrix composite, Thermal barrier coating, visual_art, Thermal, Solid mechanics, visual_art.visual_art_medium, General Materials Science, Cubic zirconia, Ceramic, Composite material
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المؤلفون: David Huitink, Kabir Enamul, Sudarshan Rangaraj, Alan Lucero
المصدر: 2014 IEEE International Reliability Physics Symposium.
مصطلحات موضوعية: Acceleration, Reliability (semiconductor), Computer science, Hardware_INTEGRATEDCIRCUITS, Mechanical integrity, Hardware_PERFORMANCEANDRELIABILITY, Temperature cycling, Chip, Extreme Cold, Die (integrated circuit), Power (physics), Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7b054fa66ed69c5f17eef9835374cd59
https://doi.org/10.1109/irps.2014.6860608 -
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المؤلفون: Terri Wilson, Ramanarayanan Panchapakesan, Ankur Aggarwal, Guotao Wang, R. Grover, Sudarshan Rangaraj, Michael P. O'Day, J. Hicks
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.
مصطلحات موضوعية: Stress (mechanics), Reliability (semiconductor), Materials science, Soldering, Hardware_INTEGRATEDCIRCUITS, Process (computing), Electronic engineering, Electronic packaging, Hardware_PERFORMANCEANDRELIABILITY, Chip, Finite element method, Characterization (materials science), Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::62e432ecaddf3d7df02453597e53fd71
https://doi.org/10.1109/ectc.2013.6575644