المؤلفون: Chbili, Z., Cheung, K. P., Campbell, P., Suehle, J. S., Ioannou, D. E., Ryu, S.-H., Lelis, A. J.

المصدر: 2013 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International. :90-93 Oct, 2013

Relation: 2013 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ryan, J. T., Southwick, R. G., Campbell, J. P., Cheung, K. P., Suehle, J. S.

المصدر: 2012 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International. :147-150 Oct, 2012

Relation: 2012 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Campbell, J. P., Drozdov, S. A., Cheung, K. P., Southwick, R. G., Ryan, J. T., Suehle, J. S., Oates, A. S.

المصدر: 2012 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International. :157-160 Oct, 2012

Relation: 2012 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ryan, J. T., Wei, L., Campbell, J. P., Southwick, R. G., Cheung, K. P., Oates, A. S., Wong, H.-S. P., Suehle, J.

المصدر: 2011 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International. :33-37 Oct, 2011

Relation: 2011 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ryan, J. T., Southwick, R. G., Campbell, J. P., Cheung, K. P., Young, C. D., Suehle, J. S.

المصدر: 2011 IEEE International Integrated Reliability Workshop Final Report Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International. :23-26 Oct, 2011

Relation: 2011 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: Ryan, J. T., Wei, L., Campbell, J. P., Southwick, R. G., Cheung, K. P., Oates, A. S., Wong, H.-S. P., Suehle, J.

المصدر: 2011 Proceedings of the ESSCIRC (ESSCIRC) ESSCIRC (ESSCIRC), 2011 Proceedings of the. :255-258 Sep, 2011

Relation: ESSCIRC 2011 - 37th European Solid State Circuits Conference

المؤلفون: Ryan, J. T., Southwick, R. G., Campbell, J. P., Cheung, K. P., Suehle, J. S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 59(11):2943-2949 Nov, 2012

المؤلفون: Suehle, J., Giapis, K., Sery, G., Eriguchi, K., Hook, T., Cheung, K.P.

المصدر: 7th International Symposium on Plasma- and Process-Induced Damage Plasma- and process-induced damage Plasma- and Process-Induced Damage, 2002 7th International Symposium on. :169-172 2002

Relation: 2002 7th International Symposium on Plasma- and Process-Induced Damage

المؤلفون: Afridi, M., Berning, D., Hefner, A., Suehle, J., Zaghloul, M., Kelley, E., Parrilla, Z., Ellenwood, C.

المصدر: Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311) Semiconductor thermal measurement and management symposium Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium. :92-98 2002

Relation: Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002

المؤلفون: Zhang, F., Cheung, K. P., Campbell, J.P., Suehle, J.

المصدر: 2010 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2010 IEEE International. :804-806 May, 2010

Relation: 2010 IEEE International Reliability Physics Symposium (IRPS)