المؤلفون: Almeida, G. F. C., Sugahara, T., Arbex, A. A., Couto, A. A., Massi, M., Montoro, F. E., Reis, D. A. P.

المصدر: Materials Research. January 2020 23(6)

مصطلحات موضوعية: Ti-6Al-4V, SiC film, HiPIMS, plasma nitriding, Creep

وصف الملف: text/html

URL الوصول: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000600215

المؤلفون: Oshio, R., Sugahara, T., Sawada, A., Kimura, M., Zhang, R., Nakashima, Y.

المصدر: IEEE Micro Micro, IEEE. 44(1):8-16 Jan, 2024

المؤلفون: Godman, B, Haque, M, Kumar, S, Islam, S, Charan, J, Akter, F, Kurdi, A, Allocati, E, Abu Bakar, M, Rahim, SA, Sultana, N, Deeba, F, Khan, MAH, Alam, ABMM, Jahan, I, Kamal, ZM, Hasin, H, unzur-E-Murshid, Nahar, S, Dutta, S, Abhayanand, JP, Kaur, RJ, Acharya, J, Sugahara, T, Kwon, HY, Bae, S, Khuan, KKP, Khan, TA, Hussain, S, Saleem, Z, Pisana, A, Wale, J, Jakovljevic, M

المصدر: Current medical research and opinion. 37(9):1529-1545

مصطلحات موضوعية: Medicin och hälsovetenskap

URL الوصول: http://kipublications.ki.se/Default.aspx?queryparsed=id:147117015

المؤلفون: Oshio, R., Sugahara, T., Sawada, A., Kimura, M., Zhang, R., Nakashima, Y.

المصدر: 2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Low-Power and High-Speed Chips (COOL CHIPS), 2022 IEEE Symposium in. :1-6 Apr, 2022

Relation: 2022 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

المؤلفون: Kim, D., Nagao, S., Chen, C., Wakasugi, N., Yamamoto, Y., Suetake, A., Takemasa, T., Sugahara, T., Suganuma, K.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 36(5):4977-4990 May, 2021

المؤلفون: Suganuma, K., Zhang, H., Nagao, S., Chen, C., Sugahara, T., Shimoyama, A., Suetake, A.

المصدر: 2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia) Power Electronics Conference (IPEC-Niigata 2018 –ECCE Asia), 2018 International. :142-147 May, 2018

Relation: 2018 International Power Electronics Conference (IPEC-Niigata 2018 –ECCE Asia)

المؤلفون: Suganuma, K., Asatani, N., Kimoto, K., Suetake, A., Zhang, H., Nagao, S., Sugahara, T.

المصدر: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2017 IMAPS Nordic Conference on. :147-150 Jun, 2017

Relation: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

المؤلفون: Seki, S., Shimoyama, A., Zhang, H., Kurosaka, S., Sugioka, T., Fujita, H., Yamamura, K., Muramatsu, T., Sugahara, T., Nagao, S., Suganuma, K.

المصدر: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :101-105 Apr, 2017

Relation: 2017 International Conference on Electronics Packaging (ICEP)

المؤلفون: Tian, K., Tay, T.E., Tan, V.B.C., Haris, A., Chew, Enquan, Pham, V.N.H., Huang, J.Z., Raju, K., Sugahara, T., Fujihara, K., Zushi, H., Liu, J.L.

المصدر: In Composites Part A August 2023 171

المؤلفون: Suganuma, K., Nagao, S., Sugahara, T., Yokoi, E., Zhang, H., Jiu, J.

المصدر: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) 3D Power Electronics Integration and Manufacturing (3D-PEIM), International Symposium on. :1-17 Jun, 2016

Relation: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)