المؤلفون: Lupinacci, A., Shapiro, A.A., Suh, J.O., Minor, A.M.

المصدر: 2013 IEEE International Symposium on Advanced Packaging Materials Advanced Packaging Materials (APM), 2013 IEEE International Symposium on. :82-88 Feb, 2013

Relation: 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM)

المؤلفون: Nah, J.W., Suh, J.O., Paik, K.W., Tu, K.N.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :50-53 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Suh, J.O., Tu, K.N., Gusak, A.M.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :27-32 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Ren, F., Nah, J.W., Suh, J.O., Tu, K.N., Xiong, B.S., Xu, L.H., Pang, J.H.L.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :66-69 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Jae-Woong Nah, Suh, J.O., Tu, K.N., Seung Wook Yoon, Chai Tai Chong, Kripesh, V., Su, B.R., Chih Chen

المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :6 pp. 2006

Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference

المؤلفون: Suh, J.O., Nah, J.W., Tu, K.N., Tamura, N.

المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :4 pp. 2006

Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference

المؤلفون: Suh, J.O., Tu, K.N., Lutsenko, G.V., Gusak, A.M.

المصدر: In Acta Materialia 2008 56(5):1075-1083

المؤلفون: Jae-Woong Nah, Kai Chen, Suh, J.O., Tu, K.N.

المصدر: 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p1450-1455, 6p

المؤلفون: Suh, J.O., Tu, K.N., Gusak, A.M.

المصدر: Proceedings International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces, 2005; 2005, p27-32, 6p

المؤلفون: Suh, J.O., Tu, K. N., Tamura, N.

المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2006, Vol. 58 Issue 6, p63-66, 4p, 5 Diagrams, 2 Graphs

مصطلحات موضوعية: SYNCHROTRONS, PARTICLE accelerators, X-rays, COPPER, NUCLEAR physics instruments