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Relation: 2024 IEEE Custom Integrated Circuits Conference (CICC)

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المساهمون: Tang, Christopher S., Series Editor^Aff1, Bouchery, Yann, editor^Aff2, Corbett, Charles J., editor^Aff3, Fransoo, Jan C., editor^Aff4, Tan, Tarkan, editor^Aff5

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Relation: 2021 IEEE 14th International Conference on ASIC (ASICON)

المؤلفون: Sun, Xichen, Huang, Jingnan, Sun, Weiwei, Chen, Bingcheng, Shen, Huiming, Wang, Yang, Feng, Jun

المصدر: In Construction and Building Materials 30 August 2024 441

المؤلفون: Sun, Xichen^Aff12, Chao, Wenhan^Aff12, Luo, Zhunchen^Aff13

المساهمون: Goos, Gerhard, Founding Editor^Aff1, Hartmanis, Juris, Founding Editor^Aff2, Bertino, Elisa, Editorial Board Member^Aff3, Gao, Wen, Editorial Board Member^Aff4, Steffen, Bernhard, Editorial Board Member^Aff5, Woeginger, Gerhard, Editorial Board Member^Aff6, Yung, Moti, Editorial Board Member^Aff7, Wang, Lu, editor^Aff8, Feng, Yansong, editor^Aff9, Hong, Yu, editor^Aff10, He, Ruifang, editor^Aff11

المصدر: Natural Language Processing and Chinese Computing : 10th CCF International Conference, NLPCC 2021, Qingdao, China, October 13–17, 2021, Proceedings, Part II. 13029:3-12

المؤلفون: Chen, Bingcheng, Sun, Weiwei ^*, Sun, Xichen, Cui, Chong, Lai, Jianzhong, Wang, Yang, Feng, Jun ^*

المصدر: In Process Biochemistry August 2021 107:100-111

المؤلفون: Miao, Ju^Aff4, Sun, Xichen^Aff4

المساهمون: Li, Defeng, Series Editor^{Aff1, Aff3}, Han, Ziman, editor^Aff2

المصدر: Translation Studies in China : The State of the Art. :203-214

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