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المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(5):776-783 May, 2024

المؤلفون: Kemmerling, J.T., Guan, R., Sadek, M., Xiong, Y., Song, J., Han, S., Isukapati, S., Sung, W., Chu, R.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(2):1153-1159 Feb, 2024

المؤلفون: Sung, W., Li, Y., Chuang, M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(1):350-358 Jan, 2024

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المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 44(6):979-982 Jun, 2023

المؤلفون: Thu, D.T., Liu, Z., Lee, Y., Kuo, T., Sung, W., Chu, Y., Chueh, Y., Fang, W.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(8):8128-8137 Apr, 2023

المؤلفون: Gorfinkel, Lev, Raghunandan, Sharmila, Watkins, Benjamin, Hebert, Kyle, Neuberg, Donna S., Bratrude, Brandi, Betz, Kayla, Yu, Alison, Choi, Sung W., Davis, Jeffrey, Duncan, Christine, Giller, Roger, Grimley, Michael, Harris, Andrew C., Jacobsohn, David, Lalefar, Nahal, Farhadfar, Nosha, Pulsipher, Michael A., Shenoy, Shalini, Petrovic, Aleksandra, Schultz, Kirk R., Yanik, Gregory A., Blazar, Bruce R., Horan, John T., Langston, Amelia, Kean, Leslie S.^{Aff1, IDs4140902402245y_cor26}, Qayed, Muna^{Aff2, IDs4140902402245y_cor27}

المصدر: Bone Marrow Transplantation: Official journal of the European Society for Blood and Marrow Transplantation. 59(5):680-687

المؤلفون: Dash, S., Li, Y., Sung, W.

المصدر: IEEE Access Access, IEEE. 11:56619-56633 2023

المؤلفون: Hsiao, S., Sung, W.

المصدر: IEEE Internet of Things Journal IEEE Internet Things J. Internet of Things Journal, IEEE. 10(1):486-498 Jan, 2023

المؤلفون: Lee, D., Baek, J., Kwon, H., Kwon, D., Cho, C., Kim, S., An, D., Chang, C., Lim, U., Im, J., Sung, W., Kim, H., Park, S., Seol, H., Kim, J., Shin, J., Kang, G., Kim, Y., Park, W., Lee, C., Lee, S., Park, T., Oh, C., Ban, H., Ko, H., Song, H., Oh, T., Hwang, S., Oh, K., Choi, J., Lee, J.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 58(1):279-290 Jan, 2023

المؤلفون: Zhang, Z., Lu, S., Wang, B., Zhang, Y., Yun, N., Sung, W., Ngo, K.D.T., Lu, G.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 37(12):14462-14470 Dec, 2022